Statement of Work (SoW) Template for PCB Technology Projects in the EEE sovereignty program - Customize for HDI work packages

Sep 12, 2026

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Statement of Work (SoW) template for PCB technology projects within the EEE sovereignty program, structured to guide proposals focused on HDI work packages while covering complementary areas such as surface finishes, solder mask, thermal management, and high-speed design. The template defines proposal sections including project overview, drivers and needs, detailed scope covering design, industrialisation, prototyping, testing and validation, documentation, and reporting. It also specifies a repeatable Work Package (WP) structure with inputs, tasks, deliverables, external review meetings, and integrated risk management approaches for credible outcomes.

LanguageEnglish

CategoryForms

FormatPDF

Pages10

Reading Time4 min

AccessFree to download

Project Title

1. Project Overview

1.1 Introduction

1.2 Drivers & Needs

2. Scope of Work

2.1 General Scope

2.2 Specific Technologies Covered

3. Work Package (WP) Structure

WP Template Elements

4. Prime Contractor Requirements

4.1 Technical Experience

ESA UNCLASSIFIED – For ESA Official Use Only Statement of Work (SoW) Template for PCB Technology Projects in the EEE sovereignty program. This template provides guidelines for proposals that focus on HDI work packages while encompassing additional areas such as surface finishes, solder mask, thermal management, and high-speed aspects. You can tailor each section to your specific technology development topic and project needs. This template provides a detailed structure that covers basic elements (clear work package definitions, inputs, tasks, deliverables, and review meetings) as well as specific points critical for PCB technology proposals. It also integrates requirements for external stakeholder reviews and detailed risk management approaches to build confidence in both the process and the final outcomes. Annex 1 provides a schematic overview of roadmap implementation, for background information. Page 1/10 ESA UNCLASSIFIED – For ESA Official Use Only Statement of Work (SoW) template Project Title: EEE Sovereignty PCB Technology Initiative Focus Technology: HDI (with complementary aspects: ENIG, solder mask, nickel-free finishes, thermal management, highspeed design, etc. ) Date: [Insert Date] Prepared by: [Prime Contractor Name / Project Team] 1. Project Overview 1.1 Introduction: Provide a concise description of the overall project, its strategic importance for EEE sovereignty, and the role of PCB technology improvements. Emphasize the need for robust HDI capabilities along with other advanced PCB features. 1.2 Drivers & Needs: 􀁸 Industry Consultation: Summarize key findings from industry consultations that have driven the need for this initiative. 􀁸 Market Needs: Outline OEM and end-customer requirements. 􀁸 Strategic Motivation: Explain why investing in HDI and complementary PCB technologies (e.g. , innovative surface finishes and thermal management) is critical. This section sets the context for the proposal and is linked closely to work package 1 below. 2. Scope of Work 2.1 General Scope: Detail the complete boundaries of the work: 􀁸 Design: Including schematic creation, layout design, and component integration for both HDI and other advanced PCB features. Include power integrity and signal integrity analysis. Include thermal management analysis. Use model-based design for reliability. 􀁸 Development/industrialisation: Commissioning of PCB manufacturing processes. 􀁸 Prototyping: Production of sample boards for accelerated coupon testing (e.g. , HATS2, D-coupon, IST) to validate manufacturing and operational performance. 􀁸 Testing & Validation: Both “quick and dirty” testing on representative samples to derisk early on in the activity, as well as the final qualification tests. Page 2/10 ESA UNCLASSIFIED – For ESA Official Use Only 􀁸 Documentation & Reporting: Generation of detailed reports with controlled document reference numbers and consistent titling. 2.2 Specific Technologies Covered: Mention and explain the relevance of several innovative materials and processes: 􀁸 Materials: Arlon 86HP, Arlon 85HP/84HP, Hitachi MCL-E-700G, Megtron 7N/8, Tachyon 100G, etc. Copper styles/roughness/thickness,(spread) glass weave, possible 1 ply dielectrics, low CTE inserts, thermal drains (coin or heat sink layer) . 􀁸 Surface finish: ENIG/ENEPIG/ENIPIG, solder mask (inkjet or screen print), potential nickel-free finishing 􀁸 PCB routing features: microvia configurations, back-drilling, non-functional pad removal, fine pitch track/gap, possible use of mSAP, possible use of copper-filled buried vias. The scope should be flexibly framed to address the evolving technology line activities defined in the annex of the EEE sovereignty compendium. 3. Work Package (WP) Structure Each Work Package (WP) in the proposal should include the following fields with clear titles and descriptions: WP Template 􀁸 WP Title: A precise title indicating the focus (e.g. , "WP1 – Review of Drivers and

FAQs

What is the purpose of this Statement of Work (SoW) template?

It provides a structured outline for proposals in the EEE sovereignty program, especially those centered on HDI work packages, while also addressing related PCB technology areas such as surface finishes and thermal management.

What topics are included in the scope of work?

The template covers design, development/industrialisation, prototyping, testing and validation, and documentation/reporting, plus specific technologies like materials, surface finish options, and PCB routing features.

What information must each Work Package (WP) include?

Each WP should include a WP title, responsible party, input documents with consistent references, detailed task descriptions, clearly defined deliverables with reference numbers and formats, and a scheduled review meeting with external stakeholders.

Sep 12, 2026

Upload by Putri