iNEMI Pb-Free Alloy Alternatives Project Addendum to Scope of Work - Version 3.2 - Task Completion Timeline

Sep 12, 2026

iNEMI Statement of Work addendum defines amended tasks for the Board Assembly TIG under the iNEMI Characterization of Pb-Free Alloy Alternatives Project (Version 3.2, June 2, 2015). It summarizes completed second-generation work, including thermal cycling to evaluate thermal fatigue performance and delivery of test protocols via the IPC-WP-013 joint white paper. It outlines extension planning for third-generation Pb-free alloys, collaboration with consortia, and resource application across procurement, test vehicles, solder assembly, microstructural characterization, thermal cycling, and data analysis.

LanguageEnglish

CategoryPresentations

FormatPDF

Pages3

Reading Time1 min

AccessFree to download

Executive Summary

Second-generation project status

Test protocol development

Project Extension and Consortia Collaboration

Collaboration rationale and member programs

Target alloy paths and anticipated benefits

Application of Resources

Scope of Work: Test Planning and Test Vehicle Development

iNEMI Statement of Work (SOW) Board Assembly TIG iNEMI Characterization of Pb-Free Alloy Alternatives Project Addendum to Scope of Work Version 3.2 June 2, 2015 Version 3.2 Date: June 2, 2015 Project Leader: Richard Coyle, ALU Co-Project Leader: Richard Parker, iNEMI iNEMI Coach: David Godlewski, iNEMI Failure Analysis (FA) Pb-Free Alloy Alternatives Task Task Chair: Richard Coyle, Alcatel-Lucent Technical Committee: The project members ofthe iNEMI Characterization of Pb-Free Alloy Alternatives Project have agreed to present to iNEMI's Technical Committee for approval vote, this proposal to amend the project's original SOW in the Board Assembly TIG; iNEMI Characterization of Pb-Free Alloy Alternatives Project version 3.2 June 1, 2015 . This addendum confirms the project's new tasks to be completed, and provides a task completion timeline, based upon current estimates. Executive Summary: Significant innovations in Pb-free solder alloy compositions have been driven by volume manufacturing and field experiences. The increasing number of Pb-free alloys provided opportunities to address shortcomings of first generation, high Ag content, near-eutectic SAC alloys such as poor performance under various types of mechanical loading and alloy cost. In 2009, the iNEMI Alloy Alternatives project was launched to address the lack of information on the thermal fatigue performance and test protocols for second generation Pb-free alloys. The status of the project after a number of years of work is as follows: o A comprehensive and extensive design of experiment based on thermal cycling and materials characterization was executed to evaluate thermal fatigue performance of second generation Pb-free solders. The thermal cycling program essentially has been completed and nine distinct conference papers have been written to document the results. One additional paper will be presented in October 2015. o The task of developing standard test requirements and methods was completed. In July 2014, the iNEMI Alloy Alternatives team and the IPC Solder Products Value Council (SPVC) jointly issued a white paper report, IPC-WP-013, Analytical Procedures for Portable Lead-Free Test Data. This document provides test protocols for physical property data and performance of new solder alloys that is reproducible and not dependent on test location. Third generation Pb-free solder alloys are emerging with the focus on two prominent development paths. In one case, alloys with Ag content lower than SAC305 are being developed to address needs for better drop/shock resistance, lower processing (melting) temperature, and lower cost. These alloys would be relevant for consumer applications and complex telecommunication applications requiring lower temperature assembly. In the other case, the high Ag content alloys are being modified with various alloying additions to improve thermal fatigue performance under conditions of severe thermal cycling and increase resistance to damage from high strain rate mechanical loading. Project Extension and Consortia Collaboration During April 2014 Spring Council Meeting project update, the Alloy Alternatives team recommended an extension of the original program to address performance of third generation Pb-free alloys. At that time, the iNEMI Board suggested that the Team consider collaborating with other industry consortia to use resources more effectively. By 3Q2014, the team had begun identifying third generation alloys and had initiated planning discussions including possible collaborations with the High Density Package User Group (HDPUG) and the Universal Consortium for Advanced Reliability of Electronic Assemblies (A.R.E.A.) . The HDPUG has three different solder reliability programs in various phases of planning. Those programs will address low Ag and high reliability solders and effects of isothermal aging. The Universal consortium has added multiple third generation solders to their 2015 test

FAQs

What does the addendum update in the original iNEMI SOW?

The addendum confirms new tasks for the project extension and provides a task completion timeline based on current estimates, while requiring TC approval for version-controlled changes.

What major accomplishments are reported for the second-generation Pb-free work?

A comprehensive design of experiments using thermal cycling and materials characterization was completed, with results documented in multiple conference papers. Standard test requirements and methods were also completed, supported by the joint IPC-WP-013 white paper.

How will the project extend to third-generation Pb-free alloys?

The extension focuses on two development paths: lower-Ag alloys to improve drop/shock resistance, lower processing temperature, and cost, and modified high-Ag alloys to improve thermal fatigue under severe cycling and high strain rate mechanical loading, supported through consortia collaboration.

Sep 12, 2026

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