Vol.44 No.39 - The Leading Information Technology News Summary - Now In Its 44hYear - October 6, 2003

Sep 29, 2026

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October 6, 2003 issue of a weekly technology news summary (Vol.44, No.39) compiling industry updates. Highlights include IBM’s new ultra-low-power transistor and mixed-signal chip approach for wireless devices, and Semiconductor Insights’ NOR flash comparison between Intel and Samsung focusing on cost per bit and die area. The issue also previews multiple partner company developments, including new LCD display technology for mobile applications and other wireless and optical system product updates.

LanguageEnglish

CategoryTechnology

FormatPDF

Pages9

Reading Time23 min

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IBMCREATESNEWTRANSISTORTHATUSES 80 PERCENT LESS POWER THAN CURRENTTECHNOLOGY

INTELOUTPERFORMS SAMSUNG INFLASHTECHNOLOGY AND COST LEADERSHIPSAYS SEMICONDUCTORINSIGHTS

SHARPDEVELOPSNEW LCD DISPLAY TECHNOLOGY FORMOBILE APPLICATIONS

Vol.44 No.39 The Leading Information Technology News Summary--Now In Its 44hYear October 6,2003 # IBMCREATESNEWTRANSISTORTHATUSES 80 PERCENT LESS POWER THANCURRENTTECHNOLOGY IBM has announced an innovative chipdesign that can improve performance fourfoldor reduce power consumption fivefold inwireless devices compared to the state-of-the-art thin-silicon bipolar technology. This achievement builds on IBM's recentannouncement of clever new design andmanufacturing methods that improve theperformance and lower the power consumptionof pure computing chips.As the wirelessindustry grows,device manufacturers will needbetter mixed-signal chips that support bothcomputing applications and high frequencycommunications applications.This new chipdesign uses arevolutionary wafer thin enough tomaximize the performance of both thecomputing and communications components. Today complementary metal oxidesemiconductor(CMOS)chips arethe foundationfor computing applications;silicon germanium(SiGe)bipolar chips provide radio frequencycommunications and analog functions.Toimprove the reliability of wireless devices,chipmanufacturershave created SiGe BiCMOSchipsthat put computing and communications # INTELOUTPERFORMS SAMSUNG INFLASHTECHNOLOGYAND COSTLEADERSHIPSAYSSEMICONDUCTORINSIGHTS Semiconductor Insights(SI),a leader intechnical and patent analyses of integratedcircuits andstructures,has announcedtheresultsof its comparative analysis of the latest NORflash offerings from Intel and Samsung. SI's discovery of a Samsung NOR flashin a Nokia smart phone back in July,confirmed (Continued on Page 2) INTHISISSUE # SHARP DEVELOPS NEWLCDDISPLAY TECHNOLOGY FORMOBILE APPLICATIONS… ……3 WI-LAN’S LIBRA 5800 FIXEDWIRELESS ACCESS PRODUCTRECEIVES FCC APPROVAL.. …4 SMC SHIPS NEW EZ-STREAMUNIVERSAL WIRELESS MULTIMEDIARECEIVER.… … ……6 NTT DATA SELECTS TERABEAMTO SUPPLY FREE SPACE OPTICSAND MILLIMETER WAVE SYSTEMS……….7 FUJITSU DEVELOPS HIGH-SPEEDMULTICHANNEL OPTICAL SWITCHBASED ON MEMS MIRRORS… …….8 CMOS Continued from Page 1)— transistors onto one chip instead of usingseparate chips for computing andcommunications applications. CMOS computing chips show higherperformance when built atop a thin silicon oninsulator(SOI)wafer.However,traditionalSiGebipolar transistors cannot be built on a thin SOIwafer.Until now,no one had been able to find atechnique to combine CMOS and SiGe bipolaronto one wafer that would maximize theperformance of both.IBM is the first to buildSiGe bipolar using a thin SOI wafer,therebypaving the way to build SiGe bipolar and CMOSon the same thin SOI wafer,maximizing theperformance of both the computing andcommunications functions. “As the wireless industry continues togrow,new devices will require greaterfunctionalities,performance,and reliabilityfrom their components,"said Dr.T.C.Chen,VPScience and Technology,IBM Research."IBMcontinues to find new methods to improve chipsto ensure that the industry can meet consumerdemands.The new chip design could beimplemented within five years,enablingapplications such as video streaming on cellphones.” IBM presented details of this new chipdesign today at the 2003 Bipolar/BiCMOSCircuits and Technology Meeting taking placethis week in Toulouse,France.This project was October 6,2003 a collaboration between researchers anddevelopers at the IBM Semiconductor Researchand Development Center,IBM Research andIBM Microelectronics Division. INTEL(Continued from Page 1) Samsung's entry into the NOR market,sendingshockwaves through the industry.“Our discoveryexposed Samsung'sNORactivities,andrevealedSamsung's critical design win with Nokia”,saidDerek Nuhn,Chief Operating Officer ofSemiconductor Insights. "Samsung is a formidable player incommodity markets and this news must attractthe attention of Intel,the dominant NOR flashplayer.However,itisclear from SI'spreliminaryanalysis on Intel's leading edge wirelessStrataFlash,t

FAQs

What technology does IBM announce to reduce power consumption in wireless devices?

IBM announces an innovative chip design using a thin SOI wafer to build SiGe bipolar and CMOS on the same thin SOI, improving performance and reducing power compared with current wireless bipolar technology.

What metric does Semiconductor Insights use when comparing Intel and Samsung NOR flash?

Semiconductor Insights focuses on cost per bit, emphasizing total die area as a key driver of the cost equation.

Which companies and technologies are featured alongside IBM and Intel/Samsung in this issue?

The issue includes Sharp’s development of new TFT LCD display technology for mobile applications and also lists other wireless and optical/receiver technology updates in the “In This Issue” section.

Sep 29, 2026

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