Samtec Final Inch QTE/QSE 5 mm Stack Height Connector - Case 2-1 Channel Properties

Sep 4, 2026

Uploaded by Tawan

Documentation explains how Samtec Final Inch QTE/QSE 5 mm stack height connector single-ended channel properties are validated through signal integrity modeling, simulations, and lab measurements. It correlates the Final Inch measurement circuit model extraction with physical VNA measurements and calibrates material parameters affecting delay, impedance, and loss. Advanced 2D/3D PCB structures are modeled with CST Microwave Studio, Sigrity BroadBand Spice, Ansoft Maxwell 2D, and Synopsis HSPICE, then compared using frequency-domain and TDR/TDT tests to improve modeling accuracy.

LanguageEnglish

CategoryResearch & Report

FormatPDF

Pages42

Reading Time1 h 46 min

AccessFree to download

Documentation Goals

Correlation and calibration objectives

Introduction and Philosophy

Modeling approach and tools

Measurement and correlation workflow

PCB Stackup and Trace Configuration

Layering, trace geometry, and material parameters

Connector Transition/Configuration

Lossy traces and vias arrangement

Eye Pattern Configuration

Stimulus, termination, and worst-case switching

Insertion and Return Loss Configuration

Frequency sweep stimulus

Samtec Final Inch™ QTE/QSE 5 mm Stack Height Connector Single Ended Channel Properties (Case 2- 1 signal surrounded by 2 grounds on each side) Scott McMorrow, Director of Engineering Jim Bell, Senior Signal Integrity Engineer Copyright © 2003 Teraspeed Consulting Group LLC Copyright © 2003 Samtec, Inc PATENT PENDING Page 1 TERASPEED CONSULTING GROUP QTE/QSE Q Strip™ Final Inch™ Board Copyright © 2003 Teraspeed Consulting Group LLC Copyright © 2003 Samtec, Inc PATENT PENDING Page 2 TERASPEED CONSULTING GROUP Documentation Goals • Provide Information for : – Correlation of Final Inch™ measurement circuit model extraction and modeling to physical VNA measurements for single ended circuits. • Provide calibration of material properties responsible for delay, impedance and loss. – Er and Loss Tangent • Show reasonable correlation of simulations to measurement. • Show limit of signaling bandwidth, modeling and measurement capabilities. Copyright © 2003 Teraspeed Consulting Group LLC Copyright © 2003 Samtec, Inc PATENT PENDING Page 3 TERASPEED CONSULTING GROUP Introduction and Philosophy The “Final Inch™” is not complete without validation of the electrical system performance through signal integrity modeling, simulations and measurements. – Advanced 2D and 3D modeling methods are used to provide accurate models for all sections of the Final Inch™ boards. • QTE/QSE connector models are developed through Samtec’s advanced modeling process, as found at [www.samtec.com](www.samtec.com). • Three dimensional PCB structures, such as SMA launches and vias, are modeled using a combination of CST Microwave Studio and Sigrity BroadBand Spice. • Two dimensional PCB traces are modeled using Ansoft Maxwell 2D FEM Field Solver and Synopsis HSPICE welement table models. • All modeled elements are combined and simulated using Synopsis HSPICE. Copyright © 2003 Teraspeed Consulting Group LLC Copyright © 2003 Samtec, Inc PATENT PENDING Page 4 TERASPEED CONSULTING GROUP Introduction and Philosophy – Test boards have been manufactured and characterized through measurements and then correlated to simulations. • Frequency domain measurements of insertion loss, return loss and crosstalk are performed with an Agilent 8720 20 GHz Vector Network Analyzer (VNA) . • TDR/TDT time domain measurements are performed with a Tektronix TDS 8000 and 20 GHz sampling heads, and captured with TDA Systems Iconnect software. • These measurements are then compared to original simulation results for correlation and modeling process improvement. • Some VNA measurements are converted to HSPICE models utilizing Sigrity BroadBand Spice, simulated in the frequency and time domain, and compared to the original simulation models. These comparisons are fed back into the modeling process to correct for PCB trace loss characteristics and provide process improvements. Copyright © 2003 Teraspeed Consulting Group LLC Copyright © 2003 Samtec, Inc PATENT PENDING Page 5 TERASPEED CONSULTING GROUP PCB Stackup and Trace Configuration • 6 layer 0.063 construction • Inner layer stripline routing. • Outer layer escape and breakout • 7.5 mil trace width • 52 ohm characteristic impedance • Er = 4.0 • Loss Tangent = 0.0215 Copyright © 2003 Teraspeed Consulting Group LLC Copyright © 2003 Samtec, Inc PATENT PENDING Page 6 TERASPEED CONSULTING GROUP PCB Stackup and Trace Configuration Connector | | | | | | | | | | SMA | | | | | | | | | | | | | | | | | | | | | B | re | | ou | t | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | | | | | | | | | Connector | | | | | | 3.44715" | | | | | Uncoupled | | | | | | | | | | | | | | | |

FAQs

What is the purpose of the documentation for the Final Inch QTE/QSE channel properties?

It defines goals for correlating the Final Inch measurement circuit model extraction to physical VNA measurements and calibrating material properties that impact delay, impedance, and loss.

Which modeling methods and software tools are used to build accurate board models?

Three-dimensional structures are modeled using CST Microwave Studio and Sigrity BroadBand Spice, while two-dimensional traces use Ansoft Maxwell 2D FEM and Synopsis HSPICE element table models; all elements are then simulated in Synopsis HSPICE.

How are simulation results validated against measurements?

Frequency-domain insertion loss, return loss, and crosstalk are measured using an Agilent 8720 20 GHz VNA, and TDR/TDT time-domain measurements are performed with a Tektronix TDS 8000 and 20 GHz sampling heads, then compared to original simulation results for correlation and model improvement.

Sep 4, 2026

Uploaded by Tawan