Packaging Diagrams and Parameters - Microchip BGA 1648-Ball Heat Spreader Extra Thick BGA (9YW) 31x31x3

Oct 23, 2026

Upload by lilac

Microchip package drawing materials for a 1648-ball heat spreader extra-thick BGA (9YW) with a staggered array multi-chip device, including top-side cooled configuration and detailed view callouts (top view, seating plane, end view, bottom view, and land pattern). Provides millimeter dimension limits and nominal values for key geometry such as overall height, ball height, lid and substrate thickness, overall length/width, ball array dimensions, and ball diameter. Includes drafting and tolerancing notes using ASME Y14.5M, clarifies BSC and REF dimensions, and specifies soldering guidance via IPC-7093.

LanguageEnglish

CategoryTechnology

FormatPDF

Pages3

Reading Time8 min

AccessFree to download

Packaging Diagrams and Parameters

Package Views and Land Pattern

Dimension Limits (Millimeters)

Notes and Tolerancing Standards

Packaging Diagrams and Parameters 1648-Ball Heat Spreader Extra Thick BGA (9YW) 31x31x3 .52mm [HB2BGA] Staggered Array Multi-Chip Device; Top Side Cooled Note: For the most current package drawings, please see the Microchip Packaging Specification located at [http://www.microchip.com/packaging](http://www.microchip.com/packaging) 1648X NOTE 1 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 A BC DE FG HJ KL MN PR TU VW YAA AB AC AD AE AF AG AHAJ AKAL AMAN APAR AT AU AVAW AY BA BBBC BD BE BF BG BH BJ BK BL BM BN BP BR BT BU BVBW BY CA CB CC CD CE CFCG CH CJ CK CL CM CN CPCR 2X 2X (M) (S) | | 0.35 | C | | --- | --- | --- | | | 0.18 | C | | --- | --- | --- | | | | | E D B A | | 0.20 | C | | --- | --- | --- | | | | | | | 0.20 | C | | --- | --- | --- | | | | | TOP VIEW SEATING PLANE END VIEW A1 A2 Microchip Technology Drawing C04-00695 Rev A Sheet 1 of 2 © 2026 Microchip Technology Inc. | | | | | | --- | --- | --- | --- | | | | | | | Packaging Diagrams and Parameters | | | | 1648-Ball Heat Spreader Extra Thick BGA (9YW) 31x31x3 .52mm [HB2BGA] Staggered Array Multi-Chip Device; Top Side Cooled Note: For the most current package drawings, please see the Microchip Packaging Specification located at [http://www.microchip.com/packaging](http://www.microchip.com/packaging) | | 0.25 | | | C | A | B | | --- | --- | --- | --- | --- | --- | --- | | | 0.10 | | | C | | | BOTTOM VIEW Notes: | Units | | MILLIMETERS | | | | --- | --- | --- | --- | --- | | Dimension Limits | | MIN | NOM | MAX | | Number of Terminals | N | 1648 | | | | Pitch | e | 0.80 BSC | | | | Overall Height | A | 3.02 | 3.27 | 3.52 | | Ball Height | A1 | 0.30 | 0.40 | 0.50 | | Lid Height | M | 1.37 REF | | | | Substrate Thickness | S | 1.43 REF | | | | Overall Length | D | 31.00 BSC | | | | Ball Array Length | D2 | 29.79 BSC | | | | Overall Width | E | 31.00 BSC | | | | Ball Array Width | E2 | 29.60 BSC | | | | Ball Diameter | b | 0.45 | 0.50 | 0.55 | 1. The A1 visual index feature may vary, but it must be located within the hatched area. 2. The package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14 .5M BSC: Basic Dimension. The theoretically exact value is shown without tolerances. REF: Reference Dimension, usually without tolerance, is for information purposes only. Microchip Technology Drawing C04-00695 Rev A Sheet 2 of 2 © 2026 Microchip Technology Inc. Land Pattern 1648-Ball Heat Spreader Extra Thick BGA (9YW) 31x31x3 .52mm [HB2BGA] Staggered Array Multi-Chip Device; Top Side Cooled Note: For the most current package drawings, please see the Microchip Packaging Specification located at [http://www.microchip.com/packaging](http://www.microchip.com/packaging) 21 3 4 5 6 7 8 9 1011121314151617181920212223242526272829303132333435363738394041424344 C2 E E | Units | | MILLIMETERS | | | | --- | --- | --- | --- | --- | | Dimension Limits | | MIN | NOM | MAX | | Contact Pitch | E | 0.80 BSC | | | | Contact Pad Spacing | C1 | | 29.79 | | | Contact Pad Spacing | C2 | | 29.60 | | | Contact Pad Diameter (Xnn) | X | | | 0.45 | | Contact Pad to Contact Pad (Xnn) | G2 | 0.30 | | | Notes: 1. Dimensioning and tolerancing per ASME Y14 .5M BSC: Basic Dimension. The theoretically exact value is shown without tolerances. 2. For best soldering results, please refer to the current industry standard IPC-7093 . Microchip Technology Drawing C04-02695 Rev A © 2026 Microchip Technology Inc.

FAQs

What package type and ball count does the drawing specify?

It specifies a 1648-ball heat spreader extra thick BGA, identified as a (9YW) staggered array multi-chip device.

Which key dimensional parameters are listed with millimeter limits?

The document lists overall height, ball height, lid height, substrate thickness, overall length and ball array length, overall width and ball array width, and ball diameter.

What standards and references govern dimensioning and soldering guidance?

Dimensioning and tolerancing follow ASME Y14.5M, and soldering guidance refers to IPC-7093. It also defines BSC (basic dimension) and REF (reference dimension).

Oct 23, 2026

Upload by lilac