E9X MQFP_208 - 28x28x3.4_MatteTin

Aug 27, 2026

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Device package homogeneous materials composition breakdown for E9X MQFP_208 with 28x28x3.4_MatteTin. Provides basic substances and associated CAS numbers, with “Contained In” sub-components such as die, leadframe, leadframe plating, die attach material, lead plating, wire, and molding compound. Reports percentage by total weight and corresponding mg/part and ppm values, including silicon, copper, nickel, magnesium, silver, epoxy/phenol resins, silica (amorphous) A/B, carbon black, tin, and other minor constituents, plus overall totals for each material group.

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Compliant with IEC 62474/ D9 .00 Compliant to IEC 61249-2-21:2003 | | | | | | | Package Homogeneous Materials | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | Device Type: E9X MQFP_208_ 28x28x3.4_MatteTin | | | | | | | | | | | | Basic Substance | CAS Number | "Contained In"
Sub-Component | % Total
Weight | mg/part | ppm | 17.80 | (mg) Total | Die | % of Total Weight | 0.31 | | Silicon | 7440-21-3 | Die | 0.313 | 17.800 | 3,133 | | Silicon | 7440-21-3 | 100.0 | | | Copper | 7440-50-8 | Leadframe | 9.766 | 554.882 | 97,658 | Total 100.00 | | | | | | Nickel | 7440-02-0 | Leadframe | 0.305 | 17.304 | 3,045 | | | | | | | Silicon | 7440-21-3 | Leadframe | 0.066 | 3.749 | 660 | 576.80 | (mg) Total | Leadframe | % of Total Weight | 10.15 | | Magnesium | 7439-95-4 | Leadframe | 0.015 | 0.865 | 152 | | Copper | 7440-50-8 | 96.2 | | | Silver | 7440-22-4 | Leadframe Plating | 0.336 | 19.100 | 3,362 | | Nickel | 7440-02-0 | 3.00 | | | Silver | 7440-22-4 | Die Attach Material | 0.009 | 0.537 | 94 | | Silicon | 7440-21-3 | 0.65 | | | 2,2'-[methylenebis(phenyleneoxymethylene)]bisoxirane | 39817-09-9 | Die Attach Material | 0.001 | 0.053 | 9 | | Magnesium | 7439-95-4 | 0.15 | | | Tetrapropenylsuccinic Anhydrid | 26544-38-7 | Die Attach Material | 0.001 | 0.053 | 9 | Total 100.00 | | | | | | 1,3-Di-2-propenyl-2-(2-propenyloxy) benzene | Trade Secret | Die Attach Material | 0.000 | 0.021 | 4 | | | | | | | Epoxide | 3234-28-4 | Die Attach Material | 0.000 | 0.021 | 4 | 19.10 | (mg) Total | Leadframe Plating | % of Total Weight | 0.34 | | 1,4-Bis(2,3-epoxypropoxy)butane | 2425-79-8 | Die Attach Material | 0.000 | 0.012 | 2 | | Silver | 7440-22-4 | 100.0 | | | Copper Oxide | 1317-38-0 | Die Attach Material | 0.000 | 0.001 | 0 | Total 100.00 | | | | | | Maleic anhydride | 108-31-6 | Die Attach Material | 0.000 | 0.004 | 1 | | | | | | | Copper | 7440-50-8 | Wire | 0.050 | 2.828 | 498 | 0.70 | Total (mg) | Die Attach Material | % of Total Weight | 0.01 | | Palladium | 7440-05-3 | Wire | 0.001 | 0.072 | 13 | | Silver | 7440-22-4 | 76.7 | | | Silver | 7440-22-4 | Wire | 0.000 | 0.000 | 0 | | 2,2'-[methylenebis(phenyleneoxymethylene)]
bisoxirane | 39817-09-9 | 7.50 | | | Epoxy Resin | Trade Secret | Molding Compound | 4.446 | 252.595 | 44,456 | | Tetrapropenylsuccinic Anhydrid | 26544-38-7 | 7.50 | | | Phenol Resin | Trade Secret | Molding Compound | 0.889 | 50.519 | 8,891 | | 1,3-Di-2-propenyl-2-(2-propenyloxy) benzene | Trade Secert | 3.00 | | | Silica (Amorphous) A | 60676-86-0 | Molding Compound | 71.130 | 4041.520 | 711,297 | | Epoxide | 3234-28-4 | 3.00 | | | Silica (Amorphous) B | 7631-86-9 | Molding Compound | 11.559 | 656.747 | 115,586 | | 1,4-Bis(2,3-epoxypropoxy)butane | 2425-79-8 | 1.75 | | | Carbon Black | 1333-86-4 | Molding Compound | 0.889 | 50.519 | 8,891 | | Copper Oxide | 1317-38-0 | 0.10 | | | Tin | 7440-31-5 | Lead Plating | 0.224 | 12.700 | 2,235 | | Maleic anhydride | 108-31-6 | 0.50 | | | TOTALS: 100.00 5681.90 1,000,000
5681.90 mg Total Mass | | | | | | Total 100.00 | | | | | | | | | | | | 2.90 | (mg) Total | Wire | % of Total Weight | 0.05 | | | | | | | | | Copper | 7440-50-8 | 97.50 | | | | | | | | | | Palladium | 7440-05-3 | 2.50 | | | | | | | | | | Silver | 7440-22-4 | 0.00 | | | | | | | | | Total 100.00 | | | | | | | | | | | | 5051.90 | (mg) Total | Molding Compound | % of Total Weight | 88.91 | | | | | | | | | Epoxy Resin | Trade Secret | 5.0 | | | | | | | | | | Phenol Resin | Trade Secret | 1.00 | | | | | | | | | | Silica (Amorphous) A | 60676-86-0 | 80.00 | | | | | | | | | | Silica (Amorphous) B | 7631-86-9 | 13.00 | | | | | | | | | | Carbon Black | 1333-86-4 | 1.00 | | | | | | | | | Total 100.00 | | | | | | | | | | | | 12.70 | (mg) Total | Lead Plating | % of Total Weight | 0.22 | | | | | |

FAQs

该文件提供的是哪类信息？

文件给出E9X MQFP_208器件在28x28x3.4_MatteTin条件下的封装均质材料组成明细，包括各物质在不同子结构中的占比与质量/浓度数据。

主要子组件有哪些？

表格列出Die、Leadframe、Leadframe Plating、Die Attach Material、Molding Compound、Wire 和 Lead Plating 等子组件，并分别给出相应成分分布。

如何读取成分的占比与单位？

每一物质同时给出% Total Weight以及mg/part、ppm等指标；并在每个子组件与总体处汇总“Total 100.00”等总量信息。

Aug 27, 2026

Upload by Fahsai