[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"detail-sidebar-cat-0-en-105":3,"doc-seo-672065-105":59,"doc-detail-672065-en":129},{"code":4,"msg":5,"data":6},0,"success",[7,13,18,23,28,33,38,43,48,51,55],{"id":8,"doc_module":4,"doc_module_name":9,"category_name":10,"show_sort_weight":11,"slug":12},1,"Document","Story & Novel",90,"story-novel",{"id":14,"doc_module":4,"doc_module_name":9,"category_name":15,"show_sort_weight":16,"slug":17},2,"Literature",80,"literature",{"id":19,"doc_module":4,"doc_module_name":9,"category_name":20,"show_sort_weight":21,"slug":22},4,"Exam",70,"exam",{"id":24,"doc_module":4,"doc_module_name":9,"category_name":25,"show_sort_weight":26,"slug":27},5,"Comic",60,"comic",{"id":29,"doc_module":4,"doc_module_name":9,"category_name":30,"show_sort_weight":31,"slug":32},6,"Technology",50,"technology",{"id":34,"doc_module":4,"doc_module_name":9,"category_name":35,"show_sort_weight":36,"slug":37},7,"Healthcare",40,"healthcare",{"id":39,"doc_module":4,"doc_module_name":9,"category_name":40,"show_sort_weight":41,"slug":42},8,"Research & Report",30,"research-report",{"id":44,"doc_module":4,"doc_module_name":9,"category_name":45,"show_sort_weight":46,"slug":47},9,"Religion & Spirituality",20,"religion-spirituality",{"id":46,"doc_module":4,"doc_module_name":9,"category_name":49,"show_sort_weight":46,"slug":50},"World Cup","world-cup",{"id":52,"doc_module":4,"doc_module_name":9,"category_name":53,"show_sort_weight":52,"slug":54},10,"Lifestyle","lifestyle",{"id":56,"doc_module":4,"doc_module_name":9,"category_name":57,"show_sort_weight":24,"slug":58},19,"General","general",{"code":4,"msg":60,"data":61},"ok",{"site_id":62,"language":63,"slug":64,"title":65,"keywords":66,"description":67,"schema_data":68,"social_meta":122,"head_meta":124,"extra_data":126,"updated_unix":128},105,"en","surface-mount-nomenclature-and-packaging-overview-introduction","SURFACE MOUNT NOMENCLATURE AND PACKAGING - Overview - Introduction","","Plain-English introduction to surface mount nomenclature and packaging, guiding readers toward understanding common package naming conventions and avoiding industry confusion. Defines the distinction between “package” (component physical shape) and “packaging” (how the component is stored), and highlights how surface mount technology and naming trends evolve over time. Covers flat chip terminology, including the 4-digit size code, how length and width are encoded, metric versus inch interpretation, and the need to consult manufacturer datasheets for thickness details.",{"@graph":69,"@context":121},[70,84,104],{"@type":71,"itemListElement":72},"BreadcrumbList",[73,77,79,82],{"item":74,"name":75,"@type":76,"position":8},"https://docshare.wps.com","Home","ListItem",{"item":78,"name":9,"@type":76,"position":14},"https://docshare.wps.com/document/",{"item":80,"name":30,"@type":76,"position":81},"https://docshare.wps.com/document/technology/",3,{"item":83,"name":65,"@type":76,"position":19},"https://docshare.wps.com/document/surface-mount-nomenclature-and-packaging-overview-introduction/672065/",{"url":83,"name":65,"@type":85,"image":86,"author":91,"headline":65,"publisher":94,"fileFormat":97,"inLanguage":63,"description":67,"dateModified":98,"datePublished":98,"encodingFormat":97,"isAccessibleForFree":99,"interactionStatistic":100},"DigitalDocument",{"url":87,"@type":88,"width":89,"height":90},"https://docshare.wps.com/thumbnails/surface-mount-nomenclature-and-packaging-overview-introduction/672065.png","ImageObject",300,407,{"name":92,"@type":93},"SALUTone","Person",{"url":74,"name":95,"@type":96},"DocShare","Organization","application/pdf","2026-11-02",true,{"@type":101,"interactionType":102,"userInteractionCount":8},"InteractionCounter",{"@type":103},"ViewAction",{"@type":105,"mainEntity":106},"FAQPage",[107,113,117],{"name":108,"@type":109,"acceptedAnswer":110},"What is the difference between “package” and “packaging” in this booklet?","Question",{"text":111,"@type":112},"“Package(s)” refers to the component’s physical shape or outline, while “packaging” describes how the component is stored. The booklet uses examples like Tape and Reel as packaging and QFP as a package.","Answer",{"name":114,"@type":109,"acceptedAnswer":115},"How does the 4-digit size code for flat chip components work?",{"text":116,"@type":112},"The first two digits represent the length from termination to termination (L), and the second two digits represent the width (W) of the termination. The booklet also notes that outside the USA the size code may be millimeters or inches.",{"name":118,"@type":109,"acceptedAnswer":119},"Does the 4-digit size code include thickness information for flat chips?",{"text":120,"@type":112},"No. Thickness (T) is not included in the 4-digit size code, so readers must consult the manufacturer’s datasheet to obtain thickness details.","https://schema.org",{"og:url":83,"og:type":123,"og:title":65,"og:site_name":95,"og:description":67},"article",{"robots":125,"canonical":83},"index,follow",{"doc_id":127,"site_id":62},672065,1793585034,{"code":4,"msg":5,"data":130},{"doc_id":127,"user_id":131,"nickname":92,"user_avatar":132,"doc_module":4,"category_id":29,"category_name":30,"doc_title":65,"doc_description":67,"doc_content":133,"file_id":134,"file_url":135,"file_type":136,"file_size":137,"view_count":8,"is_deleted":4,"is_public":8,"is_downloadable":8,"audit_status":8,"page_count":138,"language":139,"language_code":63,"site_id":62,"html_lang":63,"table_of_contents":140,"faqs":141,"seo_title":142,"seo_description":67,"update_tm":128,"read_time":143},5909897206756,"https://ap-avatar.wpscdn.com/avatar/5600152dbe4a7e99502?x-image-process=image/resize,m_fixed,w_180,h_180&k=1792654152478566863","SURFACE MOUNT NOMENCLATURE AND PACKAGING  \nTel 800-776-9888 Email [info@topline.tv](info@topline.tv)[ ](info@topline.tv)[w w w . t o p l i n e . t v](w w w . t o p l i n e . t v)  \nContents  \nOverview .............................................................................................................................................. 3  \nFlat Chip ............................................................................................................................................... 4  \nMELF Components .............................................................................................................................. 10  \nTantalum Capacitors ........................................................................................................................... 12  \nTransistors and Diodes ........................................................................................................................ 14  \nLead Styles ...........................................................................................................................................20  \nSOIC .................................................................................................................................................... 22  \nTSOP ................................................................................................................................................... 27  \nPLCC ....................................................................................................................................................28  \nLCC ......................................................................................................................................................29  \nFlat Packs ..............................................................................................................................................30  \nQFP ......................................................................................................................................................31  \nBGA (Ball Grid Array) ....................................................................................................................... 36  \nFlip Chips ........................................................................................................................................... 37  \nMicro BGA ......................................................................................................................................... 38  \nFine Pitch Terminology ...................................................................................................................... 39  \nTopArt ................................................................................................................................................. 42  \nOVERVIEW  \nThis booklet is a plain-English introduction to surface mount nomenclature and packaging. Soon you will be speaking the language of Surface Mount just like a professional.  \n1. Nomenclature  \nThere are many different types of surface mount packages. Each time anew surface mount package is developed a new name is created. These names are usually abbreviated by their initials. As an example: The Quad Flat Pack is commonly known as the QFP. Unfortunately, some packages have more than one name. This sometimes creates confusion in the industry. I will do my best to explain the subtle dif ferences between component types.  \n2. Package versus Packaging  \nLet's start by clarifying the diference between the words \"package(s)\" and\"packaging.\" The word \"package\" is used in this book to refer to the component's physical shape or outline. The word \"packaging\" is used in this book to describe how the component is stored. As an example: Tape and Reel is the packaging. QFP is a package.  \n3. Trends  \nSurface mount technology changes rapidly . However , trends can be identified. This book includes my observations of industry trends. By understanding these trends, you ","cbCaiqHMaCRS96Sc","https://ap.wps.com/l/cbCaiqHMaCRS96Sc","pdf",430918,39,"English","# Overview\n## Nomenclature\n## Package versus Packaging\n## Trends\n# Flat Chip Nomenclature\n## Size code fundamentals\n## Metric versus inches\n## Terminations and thickness notes","[{\"question\":\"What is the difference between “package” and “packaging” in this booklet?\",\"answer\":\"“Package(s)” refers to the component’s physical shape or outline, while “packaging” describes how the component is stored. The booklet uses examples like Tape and Reel as packaging and QFP as a package.\"},{\"question\":\"How does the 4-digit size code for flat chip components work?\",\"answer\":\"The first two digits represent the length from termination to termination (L), and the second two digits represent the width (W) of the termination. The booklet also notes that outside the USA the size code may be millimeters or inches.\"},{\"question\":\"Does the 4-digit size code include thickness information for flat chips?\",\"answer\":\"No. Thickness (T) is not included in the 4-digit size code, so readers must consult the manufacturer’s datasheet to obtain thickness details.\"}]","SURFACE MOUNT NOMENCLATURE AND PACKAGING - Overview - Introduction | PDF",98]