[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"doc-detail-160217-en":3,"doc-seo-160217-105":30,"detail-sidebar-cat-0-en-105":91},{"code":4,"msg":5,"data":6},0,"success",{"doc_id":7,"user_id":8,"nickname":9,"user_avatar":10,"doc_module":4,"category_id":11,"category_name":12,"doc_title":13,"doc_description":14,"doc_content":15,"file_id":16,"file_url":17,"file_type":18,"file_size":19,"view_count":4,"is_deleted":4,"is_public":20,"is_downloadable":20,"audit_status":20,"page_count":21,"language":22,"language_code":23,"site_id":24,"html_lang":23,"table_of_contents":25,"faqs":26,"seo_title":27,"seo_description":14,"update_tm":28,"read_time":29},160217,2336464648746,"Skyler","https://ap-avatar.wpscdn.com/davatar_276721f389ce27ea32af1340a28f341c",8,"Research & Report","REQUIREMENTS FOR THE PROCESS CAPABILITY APPROVAL FOR MANUFACTURING LINES OF HERMETIC HYBRID MICROCIRCUITS - ESCC Basic Specification No. 2566000 - Issue 2 - November 2014","Defines requirements for Process Capability Approval (PCA) of manufacturing lines for hermetic hybrid microcircuits intended for space applications. Specifies how manufacturers are evaluated and capability-approved for defined sets of materials and processes, including how the capability is described and published in the ESCC PCA certificate list. Applies to substrate and interconnect technologies and must be read together with ESCC Basic Specification 25600, which sets general PCA requirements, while excluding non-hermetic device manufacturing lines.","REQUIREMENTS FOR THE  \nPROCESS CAPABILITY APPROVAL  \nFOR  \nMANUFACTURING LINES  \nOF  \nHERMETIC HYBRID MICROCIRCUITS  \nESCC Basic Specification No. 2566000  \nPage 1  \nof 47  \n\n| Issue 2 | November 2014 |\n| --- | --- |\n\nDocument Custodian: European Space Agency – see [https://escies.org](https://escies.org)  \nESCC Basic Specification  \nNo. 2566000  \nPAGE 2  \nISSUE 2  \nLEGAL DISCLAIMER AND COPYRIGHT  \nEuropean Space Agency, Copyright © 2014. All rights reserved.  \nThe European Space Agency disclaims any liability or responsibility, to any person or entity, with respect to any loss or damage caused, or alleged to be caused, directly or indirectly by the use and application of this ESCC publication.  \nThis publication, without the prior permission of the European Space Agency and provided that it isnot used for a commercial purpose, may be:  \n− copied in whole, in any medium, without alteration or modification.  \n− copied in part, in any medium, provided that the ESCC document identification, comprising the ESCC symbol, document number and document issue, is removed.  \nESCC Basic Specification  \nNo. 2566000  \nPAGE 3  \nISSUE 2  \nDOCUMENTATION CHANGE NOTICE  \n(Refer to [https://escies.org](https://escies.org) for ESCC DCR content)  \n\n| DCR No. | CHANGE DESCRIPTION |\n| --- | --- |\n| 885 | Specification upissued to incorporate editorial changes per DCR. |\n\nESCC Basic Specification  \nNo. 2566000  \nPAGE 4  \nISSUE 2  \nTABLE OF CONTENTS  \n1 PURPOSE AND SCOPE 6  \n2 APPLICABLE DOCUMENTS 6  \n2.1 ESCC SPECIFICATIONS 6  \n2.2 OTHER APPLICABLE DOCUMENTS 7  \n3 TERMS, DEFINITIONS, ABBREVIATIONS, SYMBOLS AND UNITS 7  \n3.1 TERMS FROM OTHER STANDARDS 7  \n3.2 TERMS SPECIFIC TO THE PRESENT STANDARD 7  \n3.3 ABBREVIATED TERMS 9  \n4 DEFINITION OF PROCESS CAPABILITY APPROVAL FOR HYBRID LINES 10  \n5 DEFINITION OF THE PROCESS CAPABILITY DOMAIN AND ITS BOUNDARIES 12  \n5.1 GENERAL 12  \n5.1.1 Materials and processes 12  \n5.1.2 Physical Design 12  \n5.1.3 Inspection and test 13  \n5.1.4 Traceability 13  \n5.2 THE PID OF A HYBRID MANUFACTURER 13  \n5.2.1 General 13  \n5.2.2 Review and approval of the PID 13  \n6 MANUFACTURER EVALUATION 13  \n7 EVALUATION OF THE PROCESS CAPABILITY DOMAIN 14  \n7.1 GENERAL 14  \n7.2 EVALUATION TEST PROGRAMME 14  \n7.2.1 General 14  \n7.2.2 Description of Test Vehicles (TVE) 14  \n7.2.2.1 General 14  \n7.2.2.2 Definition of TVE1 test vehicle 15  \n7.2.2.3 Definition of TVE2 test vehicle 16  \n7.2.3 Examples of the two Evaluation Test Vehicles 17  \n7.3 MANUFACTURER’S AUDIT 21  \n7.4 EVALUATION TESTING 21  \n7.4.1 General 21  \n7.4.2 Initial DPA and Reference devices 22  \n7.4.3 Test plans 22  \n7.4.4 Test methods and conditions 25  \n7.4.5 Evaluation Test Report 27  \nESCC Basic Specification  \nNo. 2566000  \nPAGE 5  \nISSUE 2  \n8 PROCESS CAPABILITY APPROVAL (PCA) PHASE 28  \n8.1 GENERAL 28  \n8.2 PROCESS CAPABILITY APPROVAL TESTING 28  \n8.2.1 Definition and requirements for test vehicles for PCA testing 29  \n8.2.2 Hermetic Hybrids PCA test plans 29  \n8.2.2.1 General 29  \n8.2.2.2 Sample size 30  \n8.2.2.3 PCA test plan 31  \n8.2.3 Hermetic Hybrids PCA test methods and conditions 31  \n8.2.4 PCA test report 34  \n8.3 PROCEDURES SPECIFIC TO THE PCA OF HYBRID MANUFACTURING LINES 35  \n8.3.1 Manufacturing Line under TRB management 35  \n8.3.2 Extension or change of the Process Capability Approval Domain 35  \n8.3.3 Maintenance, suspension and withdrawal of the Process Capability Approval 37  \n8.3.3.1 Maintenance of process capability approval. 37  \n8.3.3.2 Suspension of process capability approval. 37  \n8.3.3.3 Withdrawal of process capability approval 38  \n8.3.3.4 Renewal after lapse of process capability approval 38  \n9 ANNEX 1 REQUIREMENTS GUIDELINES FOR THE MATERIALS AND PROCESSES DESCRIPTION 39  \n9.1 DEFINITION OF PROPOSED SUB-TECHNIQUES IN THE PCA DOMAIN 39  \n9.1.1 Definition of sub-techniques depending on the substrate technology 39  \n9.1.1.1 Screen Printed Thick film 39  \n9.1.1.2 Thin film deposition 40  \n9.1.1.3 HTCC (High Temperature Cofired Ceramic) 41  \n9.1.1","cbCainjiINPEGoHP","https://ap.wps.com/l/cbCainjiINPEGoHP","pdf",1921170,1,47,"English","en",105,"# Table of Contents\n## 1 Purpose and Scope\n## 2 Applicable Documents\n## 3 Terms, Definitions, Abbreviations, Symbols and Units\n## 4 Definition of Process Capability Approval for Hybrid Lines\n## 5 Definition of the Process Capability Domain and Its Boundaries\n## 6 Manufacturer Evaluation\n## 7 Evaluation of the Process Capability Domain\n## 8 Process Capability Approval (PCA) Phase\n## 9 Annex 1 Requirements Guidelines for the Materials and Processes Description\n## 10 Annex 2-Overview of the PCA Extension Application","[{\"question\":\"What is the purpose of this ESCC basic specification?\",\"answer\":\"It defines the requirements for Process Capability Approval of manufacturing lines for hermetic hybrid microcircuits intended for space application.\"},{\"question\":\"Which technologies does the specification apply to?\",\"answer\":\"It applies to substrate and interconnect technologies, as referenced in the document.\"},{\"question\":\"How is the PCA capability expected to be documented and published?\",\"answer\":\"After successful evaluation and capability approval, the capability is described and published in REP007 (ESCC List of PCA certificates).\"}]","REQUIREMENTS FOR THE PROCESS CAPABILITY APPROVAL FOR MANUFACTURING 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