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It aligns example drawings with IPC Surface-Mount Design and Land Pattern Standard IPC-SM-782 and lists included figures by package type. Content covers surface-mount leadless concepts (perimeter lands and exposed paddle) and detailed PCB pad, solder mask, stencil, solder paste, and reflow profile recommendations to support reliable solder joints and avoid solder bridging and shorts.",{"@graph":69,"@context":122},[70,84,105],{"@type":71,"itemListElement":72},"BreadcrumbList",[73,77,79,82],{"item":74,"name":75,"@type":76,"position":8},"https://docshare.wps.com","Home","ListItem",{"item":78,"name":9,"@type":76,"position":14},"https://docshare.wps.com/document/",{"item":80,"name":30,"@type":76,"position":81},"https://docshare.wps.com/document/technology/",3,{"item":83,"name":65,"@type":76,"position":19},"https://docshare.wps.com/document/pcb-layout-patterns-guidelines-leadedleadless-land-pattern-designs-and-design-guidelines-for-leadless-packages/664014/",{"url":83,"name":65,"@type":85,"image":86,"author":91,"headline":65,"publisher":94,"fileFormat":97,"inLanguage":63,"description":67,"dateModified":98,"datePublished":99,"encodingFormat":97,"isAccessibleForFree":100,"interactionStatistic":101},"DigitalDocument",{"url":87,"@type":88,"width":89,"height":90},"https://docshare.wps.com/thumbnails/pcb-layout-patterns-guidelines-leadedleadless-land-pattern-designs-and-design-guidelines-for-leadless-packages/664014.png","ImageObject",300,407,{"name":92,"@type":93},"Jiven","Person",{"url":74,"name":95,"@type":96},"DocShare","Organization","application/pdf","2026-10-30","2026-10-29",true,{"@type":102,"interactionType":103,"userInteractionCount":34},"InteractionCounter",{"@type":104},"ViewAction",{"@type":106,"mainEntity":107},"FAQPage",[108,114,118],{"name":109,"@type":110,"acceptedAnswer":111},"What standard does the application note align with for land pattern guidance?","Question",{"text":112,"@type":113},"The drawings conform to the Surface-Mount Design and Land Pattern Standard (IPC-SM-782) published by the Institute for Interconnecting and Packaging Electronic Circuits (IPC).","Answer",{"name":115,"@type":110,"acceptedAnswer":116},"What is the recommended approach for lead/terminal solder pad design?",{"text":117,"@type":113},"Use a Non-Solder Mask Defined (NSMD) approach, while leaving a small amount of solder mask between pads to help avoid solder bridging between terminals.",{"name":119,"@type":110,"acceptedAnswer":120},"Why is spacing between the PCB ground pad and land pad important?",{"text":121,"@type":113},"A minimum 0.15 mm gap is recommended to avoid solder bridging and shorting; when space permits, 0.25 mm or more is preferred.","https://schema.org",{"og:url":83,"og:type":124,"og:title":65,"og:site_name":95,"og:description":67},"article",{"robots":126,"canonical":83},"index,follow",{"doc_id":128,"site_id":62},664014,1793236410,{"code":4,"msg":5,"data":131},{"doc_id":128,"user_id":132,"nickname":92,"user_avatar":133,"doc_module":4,"category_id":29,"category_name":30,"doc_title":65,"doc_description":67,"doc_content":134,"file_id":135,"file_url":136,"file_type":137,"file_size":138,"view_count":34,"is_deleted":4,"is_public":8,"is_downloadable":8,"audit_status":8,"page_count":52,"language":139,"language_code":63,"site_id":62,"html_lang":63,"table_of_contents":140,"faqs":141,"seo_title":142,"seo_description":67,"update_tm":129,"read_time":143},1099513958607,"https://ap-avatar.wpscdn.com/avatar/100002390cf8733938c?x-image-process=image/resize,m_fixed,w_180,h_180&k=1778829742770036399","APPLICATION NOTE  \nSuggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface-Mount Guidelines for Leadless Packages  \nIntroduction  \nThis application note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These drawings conform with the Surface-Mount Design and Land Pattern Standard (IPC-SM-782) as published by the Institute for Interconnecting and Packaging Electronic Circuits (IPC) .  \nTable 1 lists the land pattern drawings in this document together with their respective figure numbers. These drawings are for reference purposes only. Skyworks recommends contacting the company doing the component mounting and soldering for more information related to actual land patterns (additional dimensions, etc.) .  \nSurface-Mount Guidelines for Leadless Packages  \nSkyworks plastic encapsulated leadless style packages are offered on a number of products to reduce size and weight and to improve application performance. These packages are referred toby such names as Quad Flat No-Lead (QFN), Leadless Plastic Chip Carrier (LPCC), Dual Flat No-Lead (DFN), et. al. All of them conform to JEDEC outline MO-220 .  \nAs indicated in Figure 1, leadless packages use perimeter landson the bottom of the package to provide contact with the PCB. These packages also have an exposed paddle on the bottom to provide a stable ground for optimum electrical performance of switches and attenuators, and an efficient heat path for thermal performance of amplifier products.  \nTable 1. PCB Land Pattern Drawings Included in This Application Note  \n\n| Package Type | Figure | Package Type | Figure |\n| --- | --- | --- | --- |\n| LGA | 4 | SOD-323 | 20 |\n| LGA-8, LGA-315 (4 .9 x 3.2 mm) | 5 | SOIC (8-Lead) | 21 |\n| LPCC-307 (16-Lead, 4 x 4 mm, Surface-Mount) | 6 | SOIC (8-Lead, Narrow Body) | 22 |\n| MSOP-8 | 7 | SOIC (14-Lead, Narrow Body) | 23 |\n| MSOP-10 | 8 | SOIC (16-Lead, Narrow Body) | 24 |\n| QFN (12-Lead, 3 x 3 mm) | 9 | SOIC (16-Lead, Wide Body) | 25 |\n| QFN (6-Lead) | 10 | SOIC (28-Lead, Wide Body) | 26 |\n| QFN (20-Lead, 4 x 4 mm) | 11 | SOT-5, SOT-6 | 27 |\n| QFN (20-Lead, 4 x 4 mm, 2.1 mm Paddle) | 12 | SOT-23 (3-Lead) | 28 |\n| QFN-306 (16-Lead, 4 x 4 mm) | 13 | SOT-143 | 29 |\n| QFN-310, QFN-364 (32-Lead, 5 x 5 mm, Surface-Mount) | 14 | SOT-666 | 30 |\n| QFN-349 (8-Lead, 2 x 2 mm) | 15 | SSOP (8-Lead, 5.3 mm) | 31 |\n| QFN-350 (16-Lead, 3 x 3 mm) | 16 | SSOP (16-Lead) | 32 |\n| SC-70 | 17 | SSOP (20-Lead) | 33 |\n| SC-70 (6-Lead), SC-88 | 18 | TSSOP (16-Lead, Exposed Pad) | 34 |\n| SC-79 | 19 | SOD-882 (Small Outline Diode) | 35 |\n\nSkyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [sales@skyworksinc.com](sales@skyworksinc.com) • [www.skyworksinc.com](www.skyworksinc.com)  \n200123M • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 9, 2017 1  \nAPPLICATION NOTE • LEADED/LEADLESS LAND PATTERN DESIGNS AND DESIGN GUIDELINES FOR LEADLESS PACKAGES  \nMold Compound  \nGold Wire  \nDown Bond  \nDIE  \nLead Exposed Die Paddle  \nS2265  \nFigure 1. Package Cross Section  \nPCB Design Guidelines  \nFor a lead/terminal solder pad design, it is recommended to use a Non-Solder Mask Defined (NSMD) approach. However, a small amount of solder mask should remain between the pads to avoidsolder bridging between terminals. The PCB land width should match package pad width. The PCB land length should be 0.1 mm greater than the package pad length, with the extra area on the outside of the package (see Figure 7 for example) .  \nThe ground pad on the PCB should match the size of the exposed paddle of the package and should be Solder Mask Defined (SMD) . The solder mask opening should overlap the edges of the PCB ground pad by 0.065 mm on all four sides. The recommended design gap between the PCB ground pad and land pad is  \n0.15 mm minimum to avoid solder bridging and shorting. When space is available, a gap of 0.25 mm or more is preferred. Plated throug","cbCaijMqzjMS3nxA","https://ap.wps.com/l/cbCaijMqzjMS3nxA","pdf",1463511,"English","# Introduction\n# Surface-Mount Guidelines for Leadless Packages\n# PCB Design Guidelines\n## Solder Mask Design\n# Solder Paste and Reflow Profile","[{\"question\":\"What standard does the application note align with for land pattern guidance?\",\"answer\":\"The drawings conform to the Surface-Mount Design and Land Pattern Standard (IPC-SM-782) published by the Institute for Interconnecting and Packaging Electronic Circuits (IPC).\"},{\"question\":\"What is the recommended approach for lead/terminal solder pad design?\",\"answer\":\"Use a Non-Solder Mask Defined (NSMD) approach, while leaving a small amount of solder mask between pads to help avoid solder bridging between terminals.\"},{\"question\":\"Why is spacing between the PCB ground pad and land pad important?\",\"answer\":\"A minimum 0.15 mm gap is recommended to avoid solder bridging and shorting; when space permits, 0.25 mm or more is preferred.\"}]","PCB Layout Patterns Guidelines - Leaded/Leadless Land Pattern Designs and Design Guidelines for Leadless Packages | PDF",25]