[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"detail-sidebar-cat-0-en-105":3,"doc-seo-657695-105":59,"doc-detail-657695-en":130},{"code":4,"msg":5,"data":6},0,"success",[7,13,18,23,28,33,38,43,48,51,55],{"id":8,"doc_module":4,"doc_module_name":9,"category_name":10,"show_sort_weight":11,"slug":12},1,"Document","Story & Novel",90,"story-novel",{"id":14,"doc_module":4,"doc_module_name":9,"category_name":15,"show_sort_weight":16,"slug":17},2,"Literature",80,"literature",{"id":19,"doc_module":4,"doc_module_name":9,"category_name":20,"show_sort_weight":21,"slug":22},4,"Exam",70,"exam",{"id":24,"doc_module":4,"doc_module_name":9,"category_name":25,"show_sort_weight":26,"slug":27},5,"Comic",60,"comic",{"id":29,"doc_module":4,"doc_module_name":9,"category_name":30,"show_sort_weight":31,"slug":32},6,"Technology",50,"technology",{"id":34,"doc_module":4,"doc_module_name":9,"category_name":35,"show_sort_weight":36,"slug":37},7,"Healthcare",40,"healthcare",{"id":39,"doc_module":4,"doc_module_name":9,"category_name":40,"show_sort_weight":41,"slug":42},8,"Research & Report",30,"research-report",{"id":44,"doc_module":4,"doc_module_name":9,"category_name":45,"show_sort_weight":46,"slug":47},9,"Religion & Spirituality",20,"religion-spirituality",{"id":46,"doc_module":4,"doc_module_name":9,"category_name":49,"show_sort_weight":46,"slug":50},"World Cup","world-cup",{"id":52,"doc_module":4,"doc_module_name":9,"category_name":53,"show_sort_weight":52,"slug":54},10,"Lifestyle","lifestyle",{"id":56,"doc_module":4,"doc_module_name":9,"category_name":57,"show_sort_weight":24,"slug":58},19,"General","general",{"code":4,"msg":60,"data":61},"ok",{"site_id":62,"language":63,"slug":64,"title":65,"keywords":66,"description":67,"schema_data":68,"social_meta":123,"head_meta":125,"extra_data":127,"updated_unix":129},105,"en","pc-and-tc-diagrams-application-note","PC and TC Diagrams - Application Note","","Application note AN2019-05 explains how to use Infineon power and thermal cycling diagrams to ensure the required lifetime of power semiconductor devices. It distinguishes junction temperature ∆Tvj-related power cycling (PC) from solder joint and case temperature ∆TC-related thermal cycling (TC). The note describes key definitions, provides application examples, and shows how to apply rainflow counting for proper cycle counting, with thermal cycling guidance limited to relevant industrial power 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Diagrams  \nAbout this document  \nScope and purpose  \nThis application note replaces AN2010-02,“Use of Power Cycling Curves for IGBT4” [1] and is applicable for the following products: industrial power modules (with/without base plate), Intelligent Power Modules (IPM), and discrete devices.  \nIt provides all required information on the use of Infineon’s power and thermal cycling diagrams and how to apply the rainflow-counting algorithm for proper cycle counting.  \nTable of Contents  \nAbout this document ....................................................................................................................... 1  \nTable of Contents ........................................................................................................................... 1  \n1 Introduction .................................................................................................................. 2  \n2 Power cycling ................................................................................................................ 3  \n2.1 Key definitions and terms ....................................................................................................................... 3  \n2.2 Application examples.............................................................................................................................. 8  \n3 Thermal cycling ............................................................................................................11  \n4 Rainflow-counting algorithm for calculating lifetimes ......................................................13  \n5 References ...................................................................................................................16  \nRevision History ............................................................................................................................ 16  \nApplication Note [www.infineon.com](www.infineon.com)  \nPlease read the Important Notice and Warnings at the end of this document  \npage 1 of 17  \nRevision 2.1 2021-02-1919  \nPC and TC Diagrams   \nIntroduction  \n1 Introduction  \nDifferent load conditions with varying thermal conditions can lead to different levels of thermal stress in applications using the same type of industrial power module, IPM module, and/or discrete device. Specification is a necessary procedure to warrant the required lifetime of a power semiconductor device. Load-generated stress should not exceed the limits defined by the corresponding diagrams.  \nThere is a distinction between two types of cycling capability, the junction temperature ∆Tvj-related power cycling ( PC), and the solder joint and case temperature ∆TC-related thermal cycling (TC) .  \nThis application note provides a better understanding of the underlying failure mechanisms, and the corresponding power and thermal cycling diagrams.  \nIn particular, the application note discusses in detail the use of both power and thermal cycling diagrams for industrial power modules.  \nWith regard to IPM modules and discrete products, the application note focuses exclusively on the power cycling diagrams. Hence, the thermal cycling information discussed in the document is not applicable for these products.  \nTherefore, as the application note covers different type of products that differ in construction, current density, size, and semiconductor technology, for example, it is important to use the specific reliability curves for the selected product.  \nApplication Note page 2 of 17 Revision 2.11  \n2021-02-1919  \nPC and TC Diagrams   \nPower cycling  \n2 Power cycling  \nTypically, the wire-bonding process is used for the electrical interconnections of the specific products discussed in this document, i.e. industrial power modules, IPMs, and discrete devices, as illustrated in Figure 1.  \nFor instance the IGBT power module sample shown in Figure 1 comprises approximately 450 wires together with 900 wedge bonds. For many years, the reliability of this contact ","cbCaimUrI88pSJDB","https://ap.wps.com/l/cbCaimUrI88pSJDB","pdf",819973,17,"English","# About this document\n# 1 Introduction\n# 2 Power cycling\n## 2.1 Key definitions and terms\n## 2.2 Application examples\n# 3 Thermal cycling\n# 4 Rainflow-counting algorithm for calculating lifetimes\n# 5 References\n# Revision History","[{\"question\":\"What is the difference between PC and TC cycling in this application note?\",\"answer\":\"PC refers to junction temperature ∆Tvj-related power cycling, while TC refers to solder joint and case temperature ∆TC-related thermal cycling.\"},{\"question\":\"Which products are the thermal cycling diagrams applicable to?\",\"answer\":\"The thermal cycling information is applicable to industrial power modules covered by the note, while IPM modules and discrete products focus exclusively on power cycling diagrams.\"},{\"question\":\"How does the note recommend calculating lifetimes from cycling data?\",\"answer\":\"It describes applying the rainflow-counting algorithm for proper cycle counting used in lifetime calculation.\"}]","PC and TC Diagrams - Application Note | PDF",1792986418,43]