[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"detail-sidebar-cat-0-en-105":3,"doc-seo-648339-105":59,"doc-detail-648339-en":130},{"code":4,"msg":5,"data":6},0,"success",[7,13,18,23,28,33,38,43,48,51,55],{"id":8,"doc_module":4,"doc_module_name":9,"category_name":10,"show_sort_weight":11,"slug":12},1,"Document","Story & Novel",90,"story-novel",{"id":14,"doc_module":4,"doc_module_name":9,"category_name":15,"show_sort_weight":16,"slug":17},2,"Literature",80,"literature",{"id":19,"doc_module":4,"doc_module_name":9,"category_name":20,"show_sort_weight":21,"slug":22},4,"Exam",70,"exam",{"id":24,"doc_module":4,"doc_module_name":9,"category_name":25,"show_sort_weight":26,"slug":27},5,"Comic",60,"comic",{"id":29,"doc_module":4,"doc_module_name":9,"category_name":30,"show_sort_weight":31,"slug":32},6,"Technology",50,"technology",{"id":34,"doc_module":4,"doc_module_name":9,"category_name":35,"show_sort_weight":36,"slug":37},7,"Healthcare",40,"healthcare",{"id":39,"doc_module":4,"doc_module_name":9,"category_name":40,"show_sort_weight":41,"slug":42},8,"Research & Report",30,"research-report",{"id":44,"doc_module":4,"doc_module_name":9,"category_name":45,"show_sort_weight":46,"slug":47},9,"Religion & Spirituality",20,"religion-spirituality",{"id":46,"doc_module":4,"doc_module_name":9,"category_name":49,"show_sort_weight":46,"slug":50},"World Cup","world-cup",{"id":52,"doc_module":4,"doc_module_name":9,"category_name":53,"show_sort_weight":52,"slug":54},10,"Lifestyle","lifestyle",{"id":56,"doc_module":4,"doc_module_name":9,"category_name":57,"show_sort_weight":24,"slug":58},19,"General","general",{"code":4,"msg":60,"data":61},"ok",{"site_id":62,"language":63,"slug":64,"title":65,"keywords":66,"description":67,"schema_data":68,"social_meta":123,"head_meta":125,"extra_data":127,"updated_unix":129},105,"en","packaging-diagrams-and-parameters-microchip-bga-1648-ball-heat-spreader-extra-thick-bga-9yw-31x31x3","Packaging Diagrams and Parameters - Microchip BGA 1648-Ball Heat Spreader Extra Thick BGA (9YW) 31x31x3","","Microchip package drawing materials for a 1648-ball heat spreader extra-thick BGA (9YW) with a staggered array multi-chip device, including top-side cooled configuration and detailed view callouts (top view, seating plane, end view, bottom view, and land pattern). Provides millimeter dimension limits and nominal values for key geometry such as overall height, ball height, lid and substrate thickness, overall length/width, ball array dimensions, and ball diameter. Includes drafting and tolerancing notes using ASME Y14.5M, clarifies BSC and REF dimensions, and specifies soldering guidance via IPC-7093.",{"@graph":69,"@context":122},[70,84,105],{"@type":71,"itemListElement":72},"BreadcrumbList",[73,77,79,82],{"item":74,"name":75,"@type":76,"position":8},"https://docshare.wps.com","Home","ListItem",{"item":78,"name":9,"@type":76,"position":14},"https://docshare.wps.com/document/",{"item":80,"name":30,"@type":76,"position":81},"https://docshare.wps.com/document/technology/",3,{"item":83,"name":65,"@type":76,"position":19},"https://docshare.wps.com/document/packaging-diagrams-and-parameters-microchip-bga-1648-ball-heat-spreader-extra-thick-bga-9yw-31x31x3/648339/",{"url":83,"name":65,"@type":85,"image":86,"author":91,"headline":65,"publisher":94,"fileFormat":97,"inLanguage":63,"description":67,"dateModified":98,"datePublished":99,"encodingFormat":97,"isAccessibleForFree":100,"interactionStatistic":101},"DigitalDocument",{"url":87,"@type":88,"width":89,"height":90},"https://docshare.wps.com/thumbnails/packaging-diagrams-and-parameters-microchip-bga-1648-ball-heat-spreader-extra-thick-bga-9yw-31x31x3/648339.png","ImageObject",300,407,{"name":92,"@type":93},"lilac","Person",{"url":74,"name":95,"@type":96},"DocShare","Organization","application/pdf","2026-10-29","2026-10-23",true,{"@type":102,"interactionType":103,"userInteractionCount":19},"InteractionCounter",{"@type":104},"ViewAction",{"@type":106,"mainEntity":107},"FAQPage",[108,114,118],{"name":109,"@type":110,"acceptedAnswer":111},"What package type and ball count does the drawing specify?","Question",{"text":112,"@type":113},"It specifies a 1648-ball heat spreader extra thick BGA, identified as a (9YW) staggered array multi-chip device.","Answer",{"name":115,"@type":110,"acceptedAnswer":116},"Which key dimensional parameters are listed with millimeter limits?",{"text":117,"@type":113},"The document lists overall height, ball height, lid height, substrate thickness, overall length and ball array length, overall width and ball array width, and ball diameter.",{"name":119,"@type":110,"acceptedAnswer":120},"What standards and references govern dimensioning and soldering guidance?",{"text":121,"@type":113},"Dimensioning and tolerancing follow ASME Y14.5M, and soldering guidance refers to IPC-7093. It also defines BSC (basic dimension) and REF (reference dimension).","https://schema.org",{"og:url":83,"og:type":124,"og:title":65,"og:site_name":95,"og:description":67},"article",{"robots":126,"canonical":83},"index,follow",{"doc_id":128,"site_id":62},648339,1792865426,{"code":4,"msg":5,"data":131},{"doc_id":128,"user_id":132,"nickname":92,"user_avatar":133,"doc_module":4,"category_id":29,"category_name":30,"doc_title":65,"doc_description":67,"doc_content":134,"file_id":135,"file_url":136,"file_type":137,"file_size":138,"view_count":19,"is_deleted":4,"is_public":8,"is_downloadable":8,"audit_status":8,"page_count":81,"language":139,"language_code":63,"site_id":62,"html_lang":63,"table_of_contents":140,"faqs":141,"seo_title":142,"seo_description":67,"update_tm":143,"read_time":39},3985747861865,"https://ap-avatar.wpscdn.com/davatar_29158cc5080c5b710cf443261637dec0","Packaging Diagrams and Parameters  \n1648-Ball Heat Spreader Extra Thick BGA (9YW) 31x31x3 .52mm [HB2BGA] Staggered Array Multi-Chip Device; Top Side Cooled  \nNote: For the most current package drawings, please see the Microchip Packaging Specification located at [http://www.microchip.com/packaging](http://www.microchip.com/packaging)  \n1648X  \nNOTE 1   \n2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43  \nA  \nBC  \nDE  \nFG  \nHJ  \nKL  \nMN  \nPR  \nTU  \nVW  \nYAA  \nAB AC  \nAD AE  \nAF AG  \nAHAJ  \nAKAL  \nAMAN  \nAPAR  \nAT AU  \nAVAW  \nAY BA  \nBBBC  \nBD BE  \nBF BG  \nBH BJ  \nBK BL  \nBM BN  \nBP BR  \nBT BU  \nBVBW  \nBY CA  \nCB CC  \nCD CE  \nCFCG  \nCH CJ  \nCK CL  \nCM CN  \nCPCR  \n2X  \n2X  \n(M)  \n(S)  \n\n| | 0.35 | C |\n| --- | --- | --- |\n\n\n| | 0.18 | C |\n| --- | --- | --- |\n|  |  |  |\n\nE  \nD  \nB  \nA  \n\n| | 0.20 | C |\n| --- | --- | --- |\n|  |  |  |\n\n\n| | 0.20 | C |\n| --- | --- | --- |\n|  |  |  |\n\nTOP VIEW  \nSEATING PLANE  \nEND VIEW  \nA1  \nA2  \nMicrochip Technology Drawing C04-00695 Rev A Sheet 1 of 2  \n© 2026 Microchip Technology Inc.  \n|  |  |  | |\n| --- | --- | --- | --- |\n|  |  |  |  |\n| Packaging Diagrams and Parameters |  |  |  |\n\n1648-Ball Heat Spreader Extra Thick BGA (9YW) 31x31x3 .52mm [HB2BGA] Staggered Array Multi-Chip Device; Top Side Cooled  \nNote: For the most current package drawings, please see the Microchip Packaging Specification located at [http://www.microchip.com/packaging](http://www.microchip.com/packaging)  \n| | 0.25 | |  | C | A | B |\n| --- | --- | --- | --- | --- | --- | --- |\n| | 0.10 |  |  | C |  |  |\n\nBOTTOM VIEW  \nNotes:  \n\n| Units |  | MILLIMETERS |  |  |\n| --- | --- | --- | --- | --- |\n| Dimension Limits |  | MIN | NOM | MAX |\n| Number of Terminals | N | 1648 |  |  |\n| Pitch | e | 0.80 BSC |  |  |\n| Overall Height | A | 3.02 | 3.27 | 3.52 |\n| Ball Height | A1 | 0.30 | 0.40 | 0.50 |\n| Lid Height | M | 1.37 REF |  |  |\n| Substrate Thickness | S | 1.43 REF |  |  |\n| Overall Length | D | 31.00 BSC |  |  |\n| Ball Array Length | D2 | 29.79 BSC |  |  |\n| Overall Width | E | 31.00 BSC |  |  |\n| Ball Array Width | E2 | 29.60 BSC |  |  |\n| Ball Diameter | b | 0.45 | 0.50 | 0.55 |\n\n1. The A1 visual index feature may vary, but it must be located within the hatched area.  \n2. The package is saw singulated.  \n3. Dimensioning and tolerancing per ASME Y14 .5M  \nBSC: Basic Dimension. The theoretically exact value is shown without tolerances.  \nREF: Reference Dimension, usually without tolerance, is for information purposes only.  \nMicrochip Technology Drawing C04-00695 Rev A Sheet 2 of 2  \n© 2026 Microchip Technology Inc.  \nLand Pattern  \n1648-Ball Heat Spreader Extra Thick BGA (9YW) 31x31x3 .52mm [HB2BGA] Staggered Array Multi-Chip Device; Top Side Cooled  \nNote: For the most current package drawings, please see the Microchip Packaging Specification located at [http://www.microchip.com/packaging](http://www.microchip.com/packaging)  \n21  \n3 4  \n5 6  \n7 8  \n9 1011121314151617181920212223242526272829303132333435363738394041424344   \nC2  \nE  \nE  \n| Units |  | MILLIMETERS |  |  |\n| --- | --- | --- | --- | --- |\n| Dimension Limits |  | MIN | NOM | MAX |\n| Contact Pitch | E | 0.80 BSC |  |  |\n| Contact Pad Spacing | C1 |  | 29.79 |  |\n| Contact Pad Spacing | C2 |  | 29.60 |  |\n| Contact Pad Diameter (Xnn) | X |  |  | 0.45 |\n| Contact Pad to Contact Pad (Xnn) | G2 | 0.30 |  |  |\n\nNotes:  \n1. Dimensioning and tolerancing per ASME Y14 .5M  \nBSC: Basic Dimension. The theoretically exact value is shown without tolerances.  \n2. For best soldering results, please refer to the current industry standard IPC-7093 .  \nMicrochip Technology Drawing C04-02695 Rev A  \n© 2026 Microchip Technology Inc.","cbCaieDrm5n4ZRw2","https://ap.wps.com/l/cbCaieDrm5n4ZRw2","pdf",700849,"English","# Packaging Diagrams and Parameters\n## Package Views and Land Pattern\n## Dimension Limits (Millimeters)\n## Notes and Tolerancing Standards","[{\"question\":\"What package type and ball count does the drawing specify?\",\"answer\":\"It specifies a 1648-ball heat spreader extra thick BGA, identified as a (9YW) staggered array multi-chip device.\"},{\"question\":\"Which key dimensional parameters are listed with millimeter limits?\",\"answer\":\"The document lists overall height, ball height, lid height, substrate thickness, overall length and ball array length, overall width and ball array width, and ball diameter.\"},{\"question\":\"What standards and references govern dimensioning and soldering guidance?\",\"answer\":\"Dimensioning and tolerancing follow ASME Y14.5M, and soldering guidance refers to IPC-7093. It also defines BSC (basic dimension) and REF (reference dimension).\"}]","Packaging Diagrams and Parameters - Microchip BGA 1648-Ball Heat Spreader Extra Thick BGA (9YW) 31x31x3 | PDF",1792793162]