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Safety information ...... 1  \nGeneral safety . . . . . . . . . . . . . . . . 1  \nElectrical safety . . . . . . . . . . . . . . . . 1  \nSafety inspection guide . . . . . . . . . . . . . 2  \nHandling devices that are sensitive to electrostatic  \ndischarge . . . . . . . . . . . . . . . . . . 3  \nGrounding requirements . . . . . . . . . . . . 4  \nSafety notices (multilingual translations) . . . . . . 4  \nChapter 2. General checkout . . . . . 19  \nWhat to do first . . . . . . . . . . . . . . . 19  \nCRU list . . . . . . . . . . . . . . . . . . 20  \nChapter 3. Identifying FRUs  \n(CRUs) ................. 21  \nLocate FRUs and CRUs . . . . . . . . . . . 21  \nChapter 4. Removing a FRU or  \nCRU .................. 27  \nService tools . . . . . . . . . . . . . . . . 27  \nGeneral guidelines . . . . . . . . . . . . . . 27  \nHandling thermal interface materials . . . . . . 28  \nType, quantity, and areas of thermal interface materials application on the heat sink .... 28  \nAreas on the system board where thermal interface materials are applied ....... 29  \nRemove the lower case . . . . . . . . . . . . 29  \nRemove the strip cover . . . . . . . . . . . . 30  \nRemove the battery pack . . . . . . . . . . . 31  \nRemove the thermal module 2 . . . . . . . . . 32  \nRemove the thermal pad . . . . . . . . . . . 32  \nRemove the solid-state drive (SSD) . . . . . . . 33  \nRemove the solid-state drive (SSD) stand off . . . 34  \nRemove the Wi-Fi card . . . . . . . . . . . . 35  \nRemove the memory module . . . . . . . . . 35  \nRemove the touchpad cable . . . . . . . . . . 36  \nRemove the CMOS battery . . . . . . . . . . 36  \nRemove the speakers 1 . . . . . . . . . . . . 37  \nRemove the backlight connector mylar. . . . . . 38  \nRemove the front lightingbar . . . . . . . . . . 39  \nRemove the thermal module 1 . . . . . . . . . 39  \nRemove the speakers 2 . . . . . . . . . . . . 40  \nRemove the rear lightingbar . . . . . . . . . . 41  \nRemove the DC-in bracket . . . . . . . . . . 42  \nRemove the I/O board . . . . . . . . . . . . 43  \nRemove the system board. . . . . . . . . . . 44  \nWrite key product information to a  \nreplacement system board. . . . . . . . . 46  \nRemove the PMIC board . . . . . . . . . . . 47  \nRemove the keyboard bracket mylar. . . . . . . 48  \nRemove the antenna . . . . . . . . . . . . . 49  \nRemove the LCD module . . . . . . . . . . . 50  \nRemove ceramic keycaps from the replaced  \nupper case (if installed by customers) .... 52  \nThe keycap kit as a FRU. . . . . . . . . . 52  \nRemove the upper case. . . . . . . . . . . . 55  \nDisassemble the LCD module . . . . . . . . . 56  \nRemove the hinge cap . . . . . . . . . . 56  \nRemove the LCD bezel . . . . . . . . . . 56  \nRemove the LCD panel . . . . . . . . . . 57  \nRemove the camera bracket . . . . . . . . 59  \nRemove the microphone rubbers . . . . . . 60  \nRemove the camera cable . . . . . . . . . 61  \nRemove the camera . . . . . . . . . . . 62  \nRemove the camera conductive tape. . . . . 62  \nRemove the LCD cover . . . . . . . . . . 63  \nAppendix A. Label locations. . . . . . 65  \nTrademarks . . . . . . . . . . . . . . . . lxvii  \n© Copyright Lenovo 2025 i  \nii Hardware Maintenance Manual  \nAbout this manual  \nThis manual contains service and reference information for the following Lenovo products.  \n\n| Model name | Machine type (MT) |\n| --- | --- |\n| • Legion Pro 7 16IAX10H\u003Cbr>• Lenovo Legion Pro 7 16IAX10H | 83F5 |\n\nImportant:  \n• It is recommended that these products be repaired by trained service technicians. For customers electing to repair their own Lenovo products, please follow all instructions carefully.  \n• Before servicing a Lenovo product, be sure to read all the information under Chapter 1 “Safety information” on page 1.  \n© Copyright Lenovo 2025 iii  \niv Hardware Maintenance Manual  \n\n| Chapter 1. Safety information","cbCaieu67ynqGdBk","https://ap.wps.com/l/cbCaieu67ynqGdBk","pdf",23792566,76,"English","# About this manual\n# Chapter 1: Safety information\n## General safety\n## Electrical safety\n## Safety inspection guide\n## Handling devices that are sensitive to electrostatic discharge\n## Grounding requirements\n## Safety notices (multilingual translations)\n# Chapter 2: General checkout\n## What to do first\n## CRU list\n# Chapter 3: Identifying FRUs (CRUs)\n## Locate FRUs and CRUs\n# Chapter 4: Removing a FRU or CRU\n## Service tools\n## General guidelines\n## Handling thermal interface materials","[{\"question\":\"What safety rules must be followed before servicing a Lenovo notebook?\",\"answer\":\"The manual instructs service personnel to follow general safety rules and ensure good housekeeping, safe lifting practices, and that other people are not in hazardous positions. It also emphasizes reinstalling safety shields, guards, labels, and ground wires after service.\"},{\"question\":\"How does the manual address electrical and electrostatic discharge safety?\",\"answer\":\"It includes electrical safety guidance and covers handling devices sensitive to electrostatic discharge, along with grounding requirements. It also provides safety notices with multilingual translations.\"},{\"question\":\"What does the manual cover for servicing FRUs and CRUs?\",\"answer\":\"It provides procedures to identify and locate FRUs/CRUs, lists customer-relevant replaceable components, and gives general guidelines for removing a FRU or CRU. It further details component removal steps supported by service tools and thermal interface handling guidance.\"}]","Hardware Maintenance Manual - Legion Pro 7i (16”,10) - First Edition (February 2025) | PDF",1792726157,192]