[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"doc-detail-81848-en":3,"doc-seo-81848-105":31,"detail-sidebar-cat-0-en-105":93},{"code":4,"msg":5,"data":6},0,"success",{"doc_id":7,"user_id":8,"nickname":9,"user_avatar":10,"doc_module":4,"category_id":11,"category_name":12,"doc_title":13,"doc_description":14,"doc_content":15,"file_id":16,"file_url":17,"file_type":18,"file_size":19,"view_count":20,"is_deleted":4,"is_public":21,"is_downloadable":21,"audit_status":21,"page_count":22,"language":23,"language_code":24,"site_id":25,"html_lang":24,"table_of_contents":26,"faqs":27,"seo_title":28,"seo_description":14,"update_tm":29,"read_time":30},81848,5909877438554,"Maeve","https://ap-avatar.wpscdn.com/avatar/5600025385ad2bf12a7?_k=1778553567797529272",8,"Research & Report","FAPlace Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems","Chiplet placement on a silicon interposer is central to 2.5D system integration, yet prior methods assume a fixed interposer footprint, creating a circular dependency between footprint size knowledge and placement feasibility. Oversized footprints can force overly sparse layouts and poor aspect ratios, while undersized footprints may eliminate valid solutions. FAPlace introduces a footprint-aware mask guided sequential placement framework that outputs an optimized interposer footprint from a sufficiently large canvas, combining compactness and aspect-ratio penalties with wirelength and thermal guidance for deterministic multi-physics optimization and strong experimental results.","FAPlace: Joint Optimization of Chiplet Placement and Interposer  \nFootprint for 2.5D Systems  \nYubo Hou  \nInstitute for Infocomm Research, Agency for Science, Technology and Research (A*STAR) Singapore, Singapore [Hou_Yubo@a-star.edu.sg](Hou_Yubo@a-star.edu.sg)  \nSezin Kircali Ata  \nInstitute for Infocomm Research, Agency for Science, Technology and Research (A*STAR) Singapore, Singapore [Ata_Kircali_Sezin@a-star.edu.sg](Ata_Kircali_Sezin@a-star.edu.sg)  \nGen Liang Lim  \nInstitute for Infocomm Research, Agency for Science, Technology and Research (A*STAR) Singapore, Singapore [lim_gen_liang@a-star.edu.sg](lim_gen_liang@a-star.edu.sg)  \narXiv :2607 .026 10v 1 [ cs .AR] 1 Jul 2026  \nRichard Chang  \nInstitute for Infocomm Research, Agency for Science, Technology and Research (A*STAR) Singapore, Singapore [Richard_Chang@a-star.edu.sg](Richard_Chang@a-star.edu.sg)  \nMihai Dragos Rotaru  \nInstitute of Microelectronics, Agency for Science, Technology and Research (A*STAR) Singapore, Singapore [Mihai_Dragos_Rotaru@a-star.edu.sg](Mihai_Dragos_Rotaru@a-star.edu.sg)  \nRahul Dutta  \nInstitute of Microelectronics, Agency for Science, Technology and Research (A*STAR) Singapore, Singapore [duttar@a-star.edu.sg](duttar@a-star.edu.sg)  \nAshish James  \nInstitute for Infocomm Research, Agency for Science, Technology and Research (A*STAR) Singapore, Singapore [ashish_james@a-star.edu.sg](ashish_james@a-star.edu.sg)  \nAbstract  \nThe placement of chiplets on a silicon interposer is a pivotal step in 2.5D system integration, yet existing placement approaches typically assume a pre-defined interposer footprint. This creates a circular dependency: the optimal footprint cannot be known without first solving the placement, while the placement itself is constrained by the given dimensions. An undersized interposer may exclude feasible placements, while an oversized one yields unnecessarily sparse solutions. Moreover, even when the footprint area is minimized, few existing approaches explicitly control the interposer’s aspect ratio. To jointly address these challenges, we propose FAPlace, a footprint aware mask guided sequential placement framework. FAPlace operates on a sufficiently large canvas, eliminating the circular dependency by allowing the optimal interposer footprint to emerge asan output of the optimization rather than a pre-specified input. At its core is a novel footprint mask that fuses area compactness with an aspect ratio penalty into a unified spatial cost map. Integrated with wirelength and thermal guidance masks, FAPlace delivers holistic multi-physics optimization in a deterministic, single pass process. Experimental results demonstrate that FAPlace reduces wirelength and footprint area while achieving near-unity aspect ratios, without compromising on thermal performance.  \nThis work is licensed under a Creative Commons Attribution 4 .0 International License. GLSVLSI ’26, Canandaigua, NY, USA  \n© 2026 Copyright held by the owner/author(s) .  \nACM ISBN 979-8-4007-2431-2/2026/06  \n[https://doi.org/10.1145/3787109.3815298](https://doi.org/10.1145/3787109.3815298)  \nCCS Concepts  \n• Hardware → Physical design (EDA); Electronic design automation.  \nKeywords  \n2.5D System, Chiplet Placement, Aspect Ratio, Interposer Footprint, Multi-physics Optimization.  \nACM Reference Format:  \nYubo Hou, Sezin Kircali Ata, Gen Liang Lim, Richard Chang, Mihai Dragos Rotaru, Rahul Dutta, and Ashish James. 2026. FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems. In Great Lakes Symposium on VLSI 2026 (GLSVLSI ’26), June 22–24, 2026, Canandaigua, NY, USA. ACM, New York, NY, USA, 6 pages. [https://doi.org/10.1145/3787109](https://doi.org/10.1145/3787109) . 3815298  \n1 Introduction  \nThe growing demand for heterogeneous, high-performance computing has propelled 2.5D chiplet integration to the forefront of advanced packaging [7] . By assembling pre-verified chiplets on a silicon interposer, 2.5D systems deliver superior per","cbCaieftqkXsPvR9","https://ap.wps.com/l/cbCaieftqkXsPvR9","pdf",1956467,9,1,6,"English","en",105,"# Introduction\n## Motivation and circular dependency\n## Proposed FAPlace framework","[{\"question\":\"What circular dependency does FAPlace address in 2.5D chiplet placement?\",\"answer\":\"Existing approaches require a pre-defined interposer footprint, but the optimal footprint depends on the placement. This creates a circular dependency where placement feasibility is constrained by assumed dimensions.\"},{\"question\":\"How does FAPlace avoid needing a pre-specified interposer footprint?\",\"answer\":\"FAPlace operates on a sufficiently large canvas so the optimized interposer footprint emerges as an output of the optimization rather than being provided as an input.\"},{\"question\":\"What is the role of the footprint mask in FAPlace?\",\"answer\":\"The footprint mask unifies area compactness and an aspect-ratio penalty into a spatial cost map, supporting holistic optimization together with wirelength and thermal guidance.\"}]","FAPlace Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems | PDF",1784176631,15,{"code":4,"msg":32,"data":33},"ok",{"site_id":25,"language":24,"slug":34,"title":13,"keywords":35,"description":14,"schema_data":36,"social_meta":88,"head_meta":90,"extra_data":92,"updated_unix":29},"faplace-joint-optimization-of-chiplet-placement-and-interposer-footprint-for-25d-systems","",{"@graph":37,"@context":87},[38,55,70],{"@type":39,"itemListElement":40},"BreadcrumbList",[41,45,49,52],{"item":42,"name":43,"@type":44,"position":21},"https://docshare.wps.com","Home","ListItem",{"item":46,"name":47,"@type":44,"position":48},"https://docshare.wps.com/document/","Document",2,{"item":50,"name":12,"@type":44,"position":51},"https://docshare.wps.com/document/research-report/",3,{"item":53,"name":13,"@type":44,"position":54},"https://docshare.wps.com/document/faplace-joint-optimization-of-chiplet-placement-and-interposer-footprint-for-25d-systems/81848/",4,{"url":53,"name":13,"@type":56,"author":57,"headline":13,"publisher":59,"fileFormat":62,"inLanguage":24,"description":14,"dateModified":63,"datePublished":64,"encodingFormat":62,"isAccessibleForFree":65,"interactionStatistic":66},"DigitalDocument",{"name":9,"@type":58},"Person",{"url":42,"name":60,"@type":61},"DocShare","Organization","application/pdf","2026-07-29","2026-07-16",true,{"@type":67,"interactionType":68,"userInteractionCount":20},"InteractionCounter",{"@type":69},"ViewAction",{"@type":71,"mainEntity":72},"FAQPage",[73,79,83],{"name":74,"@type":75,"acceptedAnswer":76},"What circular dependency does FAPlace address in 2.5D chiplet placement?","Question",{"text":77,"@type":78},"Existing approaches require a pre-defined interposer footprint, but the optimal footprint depends on the placement. This creates a circular dependency where placement feasibility is constrained by assumed dimensions.","Answer",{"name":80,"@type":75,"acceptedAnswer":81},"How does FAPlace avoid needing a pre-specified interposer footprint?",{"text":82,"@type":78},"FAPlace operates on a sufficiently large canvas so the optimized interposer footprint emerges as an output of the optimization rather than being provided as an input.",{"name":84,"@type":75,"acceptedAnswer":85},"What is the role of the footprint mask in FAPlace?",{"text":86,"@type":78},"The footprint mask unifies area compactness and an aspect-ratio penalty into a spatial cost map, supporting holistic optimization together with wirelength and thermal guidance.","https://schema.org",{"og:url":53,"og:type":89,"og:title":13,"og:site_name":60,"og:description":14},"article",{"robots":91,"canonical":53},"index,follow",{"doc_id":7,"site_id":25},{"code":4,"msg":5,"data":94},[95,99,103,107,112,116,121,124,128,131,135],{"id":21,"doc_module":4,"doc_module_name":47,"category_name":96,"show_sort_weight":97,"slug":98},"Story & Novel",90,"story-novel",{"id":48,"doc_module":4,"doc_module_name":47,"category_name":100,"show_sort_weight":101,"slug":102},"Literature",80,"literature",{"id":54,"doc_module":4,"doc_module_name":47,"category_name":104,"show_sort_weight":105,"slug":106},"Exam",70,"exam",{"id":108,"doc_module":4,"doc_module_name":47,"category_name":109,"show_sort_weight":110,"slug":111},5,"Comic",60,"comic",{"id":22,"doc_module":4,"doc_module_name":47,"category_name":113,"show_sort_weight":114,"slug":115},"Technology",50,"technology",{"id":117,"doc_module":4,"doc_module_name":47,"category_name":118,"show_sort_weight":119,"slug":120},7,"Healthcare",40,"healthcare",{"id":11,"doc_module":4,"doc_module_name":47,"category_name":12,"show_sort_weight":122,"slug":123},30,"research-report",{"id":20,"doc_module":4,"doc_module_name":47,"category_name":125,"show_sort_weight":126,"slug":127},"Religion & Spirituality",20,"religion-spirituality",{"id":126,"doc_module":4,"doc_module_name":47,"category_name":129,"show_sort_weight":126,"slug":130},"World Cup","world-cup",{"id":132,"doc_module":4,"doc_module_name":47,"category_name":133,"show_sort_weight":132,"slug":134},10,"Lifestyle","lifestyle",{"id":136,"doc_module":4,"doc_module_name":47,"category_name":137,"show_sort_weight":108,"slug":138},19,"General","general"]