[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"doc-detail-152002-en":3,"doc-seo-152002-105":29,"detail-sidebar-cat-0-en-105":88},{"code":4,"msg":5,"data":6},0,"success",{"doc_id":7,"user_id":8,"nickname":9,"user_avatar":10,"doc_module":4,"category_id":11,"category_name":12,"doc_title":13,"doc_description":14,"doc_content":15,"file_id":16,"file_url":17,"file_type":18,"file_size":19,"view_count":4,"is_deleted":4,"is_public":20,"is_downloadable":20,"audit_status":20,"page_count":20,"language":21,"language_code":22,"site_id":23,"html_lang":22,"table_of_contents":24,"faqs":25,"seo_title":26,"seo_description":14,"update_tm":27,"read_time":28},152002,549768702563,"Fahsai","https://ap-avatar.wpscdn.com/avatar/8000c4aa63b76e948b?x-image-process=image/resize,m_fixed,w_180,h_180&k=1786536092046926083",6,"Technology","E9X MQFP_208 - 28x28x3.4_MatteTin","Device package homogeneous materials composition breakdown for E9X MQFP_208 with 28x28x3.4_MatteTin. Provides basic substances and associated CAS numbers, with “Contained In” sub-components such as die, leadframe, leadframe plating, die attach material, lead plating, wire, and molding compound. Reports percentage by total weight and corresponding mg/part and ppm values, including silicon, copper, nickel, magnesium, silver, epoxy/phenol resins, silica (amorphous) A/B, carbon black, tin, and other minor constituents, plus overall totals for each material group.","Compliant with IEC 62474/ D9 .00 Compliant to IEC 61249-2-21:2003  \n\n| |  |  |  |  |  | Package Homogeneous Materials |  |  |  |  |\n| --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- |\n| Device Type: E9X MQFP_208_ 28x28x3.4_MatteTin |  |  |  |  |  |  |  |  |  |  |\n| Basic Substance | CAS Number | \"Contained In\"\u003Cbr>Sub-Component | % Total\u003Cbr>Weight | mg/part | ppm | 17.80 | (mg) Total | Die | % of Total Weight | 0.31 |\n| Silicon | 7440-21-3 | Die | 0.313 | 17.800 | 3,133 |  | Silicon | 7440-21-3 | 100.0 |  |\n| Copper | 7440-50-8 | Leadframe | 9.766 | 554.882 | 97,658 | Total 100.00 |  |  |  |  |\n| Nickel | 7440-02-0 | Leadframe | 0.305 | 17.304 | 3,045 |  |  |  |  |  |\n| Silicon | 7440-21-3 | Leadframe | 0.066 | 3.749 | 660 | 576.80 | (mg) Total | Leadframe | % of Total Weight | 10.15 |\n| Magnesium | 7439-95-4 | Leadframe | 0.015 | 0.865 | 152 |  | Copper | 7440-50-8 | 96.2 |  |\n| Silver | 7440-22-4 | Leadframe Plating | 0.336 | 19.100 | 3,362 |  | Nickel | 7440-02-0 | 3.00 |  |\n| Silver | 7440-22-4 | Die Attach Material | 0.009 | 0.537 | 94 |  | Silicon | 7440-21-3 | 0.65 |  |\n| 2,2'-[methylenebis(phenyleneoxymethylene)]bisoxirane | 39817-09-9 | Die Attach Material | 0.001 | 0.053 | 9 |  | Magnesium | 7439-95-4 | 0.15 |  |\n| Tetrapropenylsuccinic Anhydrid | 26544-38-7 | Die Attach Material | 0.001 | 0.053 | 9 | Total 100.00 |  |  |  |  |\n| 1,3-Di-2-propenyl-2-(2-propenyloxy) benzene | Trade Secret | Die Attach Material | 0.000 | 0.021 | 4 |  |  |  |  |  |\n| Epoxide | 3234-28-4 | Die Attach Material | 0.000 | 0.021 | 4 | 19.10 | (mg) Total | Leadframe Plating | % of Total Weight | 0.34 |\n| 1,4-Bis(2,3-epoxypropoxy)butane | 2425-79-8 | Die Attach Material | 0.000 | 0.012 | 2 |  | Silver | 7440-22-4 | 100.0 |  |\n| Copper Oxide | 1317-38-0 | Die Attach Material | 0.000 | 0.001 | 0 | Total 100.00 |  |  |  |  |\n| Maleic anhydride | 108-31-6 | Die Attach Material | 0.000 | 0.004 | 1 |  |  |  |  |  |\n| Copper | 7440-50-8 | Wire | 0.050 | 2.828 | 498 | 0.70 | Total (mg) | Die Attach Material | % of Total Weight | 0.01 |\n| Palladium | 7440-05-3 | Wire | 0.001 | 0.072 | 13 |  | Silver | 7440-22-4 | 76.7 |  |\n| Silver | 7440-22-4 | Wire | 0.000 | 0.000 | 0 |  | 2,2'-[methylenebis(phenyleneoxymethylene)]\u003Cbr>bisoxirane | 39817-09-9 | 7.50 |  |\n| Epoxy Resin | Trade Secret | Molding Compound | 4.446 | 252.595 | 44,456 |  | Tetrapropenylsuccinic Anhydrid | 26544-38-7 | 7.50 |  |\n| Phenol Resin | Trade Secret | Molding Compound | 0.889 | 50.519 | 8,891 |  | 1,3-Di-2-propenyl-2-(2-propenyloxy) benzene | Trade Secert | 3.00 |  |\n| Silica (Amorphous) A | 60676-86-0 | Molding Compound | 71.130 | 4041.520 | 711,297 |  | Epoxide | 3234-28-4 | 3.00 |  |\n| Silica (Amorphous) B | 7631-86-9 | Molding Compound | 11.559 | 656.747 | 115,586 |  | 1,4-Bis(2,3-epoxypropoxy)butane | 2425-79-8 | 1.75 |  |\n| Carbon Black | 1333-86-4 | Molding Compound | 0.889 | 50.519 | 8,891 |  | Copper Oxide | 1317-38-0 | 0.10 |  |\n| Tin | 7440-31-5 | Lead Plating | 0.224 | 12.700 | 2,235 |  | Maleic anhydride | 108-31-6 | 0.50 |  |\n| TOTALS: 100.00 5681.90 1,000,000\u003Cbr>5681.90 mg Total Mass |  |  |  |  |  | Total 100.00 |  |  |  |  |\n|  |  |  |  |  |  | 2.90 | (mg) Total | Wire | % of Total Weight | 0.05 |\n|  |  |  |  |  |  |  | Copper | 7440-50-8 | 97.50 |  |\n|  |  |  |  |  |  |  | Palladium | 7440-05-3 | 2.50 |  |\n|  |  |  |  |  |  |  | Silver | 7440-22-4 | 0.00 |  |\n|  |  |  |  |  |  | Total 100.00 |  |  |  |  |\n|  |  |  |  |  |  | 5051.90 | (mg) Total | Molding Compound | % of Total Weight | 88.91 |\n|  |  |  |  |  |  |  | Epoxy Resin | Trade Secret | 5.0 |  |\n|  |  |  |  |  |  |  | Phenol Resin | Trade Secret | 1.00 |  |\n|  |  |  |  |  |  |  | Silica (Amorphous) A | 60676-86-0 | 80.00 |  |\n|  |  |  |  |  |  |  | Silica (Amorphous) B | 7631-86-9 | 13.00 |  |\n|  |  |  |  |  |  |  | Carbon Black | 1333-86-4 | 1.00 |  |\n|  |  |  |  |  |  | Total 100.00 |  |  |  |  |\n|  |  |  |  |  |  | 12.70 | (mg) Total | Lead Plating | % of Total Weight | 0.22 |\n|  |  |  |  |","cbCaiqdVpoFEQdDR","https://ap.wps.com/l/cbCaiqdVpoFEQdDR","pdf",314008,1,"English","en",105,"","[{\"question\":\"该文件提供的是哪类信息？\",\"answer\":\"文件给出E9X MQFP_208器件在28x28x3.4_MatteTin条件下的封装均质材料组成明细，包括各物质在不同子结构中的占比与质量/浓度数据。\"},{\"question\":\"主要子组件有哪些？\",\"answer\":\"表格列出Die、Leadframe、Leadframe Plating、Die Attach Material、Molding Compound、Wire 和 Lead Plating 等子组件，并分别给出相应成分分布。\"},{\"question\":\"如何读取成分的占比与单位？\",\"answer\":\"每一物质同时给出% Total Weight以及mg/part、ppm等指标；并在每个子组件与总体处汇总“Total 100.00”等总量信息。\"}]","E9X MQFP_208 - 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