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It provides full fabrication workflow across frontend, backend processing and packaging, including advanced cleanroom capabilities and extensive characterization tools. Core strengths span advanced semiconductor processing and materials characterization, supporting domains such as nanoelectronics, flexible electronics, spintronics, quantum technology, microfluidics, sensors and photonics, plus open access and expert-matching collaboration.",{"@graph":69,"@context":125},[70,84,104],{"@type":71,"itemListElement":72},"BreadcrumbList",[73,77,79,82],{"item":74,"name":75,"@type":76,"position":8},"https://docshare.wps.com","Home","ListItem",{"item":78,"name":9,"@type":76,"position":14},"https://docshare.wps.com/document/",{"item":80,"name":30,"@type":76,"position":81},"https://docshare.wps.com/document/technology/",3,{"item":83,"name":65,"@type":76,"position":19},"https://docshare.wps.com/document/e6nanofab-enabling-cutting-edge-research/634754/",{"url":83,"name":65,"@type":85,"image":86,"author":91,"headline":65,"publisher":94,"fileFormat":97,"inLanguage":63,"description":67,"dateModified":98,"datePublished":98,"encodingFormat":97,"isAccessibleForFree":99,"interactionStatistic":100},"DigitalDocument",{"url":87,"@type":88,"width":89,"height":90},"https://docshare.wps.com/thumbnails/e6nanofab-enabling-cutting-edge-research/634754.png","ImageObject",300,407,{"name":92,"@type":93},"Guten Appetit_Joghurt","Person",{"url":74,"name":95,"@type":96},"DocShare","Organization","application/pdf","2026-10-22",true,{"@type":101,"interactionType":102,"userInteractionCount":4},"InteractionCounter",{"@type":103},"ViewAction",{"@type":105,"mainEntity":106},"FAQPage",[107,113,117,121],{"name":108,"@type":109,"acceptedAnswer":110},"What is E6NanoFab’s primary role in research collaboration?","Question",{"text":111,"@type":112},"E6NanoFab enables and streamlines micro-nanofabrication R&D by supporting multidisciplinary academic and industrial activities in nanotechnology and microelectronics. It also matches researchers with relevant experts to solve specific problems.","Answer",{"name":114,"@type":109,"acceptedAnswer":115},"What fabrication capabilities are offered beyond deposition equipment?",{"text":116,"@type":112},"E6NanoFab supports the full fabrication process flow, including frontend and backend processing and packaging. It also operates multiple cleanroom environments and offers extensive characterization and process tools.",{"name":118,"@type":109,"acceptedAnswer":119},"Which deposition technologies does E6NanoFab provide?",{"text":120,"@type":112},"E6NanoFab provides Atomic Layer Deposition (ALD), PECVD, ultra-high vacuum metal/dielectric sputtering, ultra-high vacuum E-beam evaporation, thermal evaporation, and Molecular Beam Epitaxy (MBE). Each includes listed precursors/targets and operating details.",{"name":122,"@type":109,"acceptedAnswer":123},"How does E6NanoFab support micro-nano patterning and surface treatment?",{"text":124,"@type":112},"It offers etching processes including Ion Beam Deposition and Etching (IBE), XeF2 vapor etching, ICP etch cluster modules for metal/dielectric/III-V compounds, and reactive ion plasma etching systems, covering both dry and wet needs stated in the document.","https://schema.org",{"og:url":83,"og:type":127,"og:title":65,"og:site_name":95,"og:description":67},"article",{"robots":129,"canonical":83},"index,follow",{"doc_id":131,"site_id":62},634754,1792674447,{"code":4,"msg":5,"data":134},{"doc_id":131,"user_id":135,"nickname":92,"user_avatar":136,"doc_module":4,"category_id":29,"category_name":30,"doc_title":65,"doc_description":67,"doc_content":137,"file_id":138,"file_url":139,"file_type":140,"file_size":141,"view_count":4,"is_deleted":4,"is_public":8,"is_downloadable":8,"audit_status":8,"page_count":142,"language":143,"language_code":63,"site_id":62,"html_lang":63,"table_of_contents":144,"faqs":145,"seo_title":146,"seo_description":67,"update_tm":132,"read_time":147},1374408768420,"https://ap-avatar.wpscdn.com/davatar_6f874abed73319feea01a86fa6f0fab8","E6NanoFab  \nEnabling Cutting-edge Research  \nE6NanoFab  \nEnabling cutting-edge research  \nAbout Us  \nE6NanoFab is a micro-nanofabrication research center that streamlines and facilitates multidisciplinary academic and industrial research activities in nanotechnology and microelectronics.  \n▪ Class 10, 100, 1000 and 10000 cleanroom.  \n▪ Over 100 Characterisation and process tools across the 2746 sqm laboratories floor space.  \nCapability  \nWe support full fabrication process flow including frontend and backend processing, and packaging.  \n• Full 8“(200mm) wafer processing capability.  \n• Nano and micro mix and match integration.  \n• Wide range of materials and devices.  \nCore competency  \n▪ Advanced semiconductor processing and materials Characterisation for advanced technology.  \n▪ Broad research domain: Nanoelectronics, flexible electronics, spintronics, quantum technology, microfluidics, sensors and photonics.  \nOur Expertise  \nE6NanoFab houses over 20 principal investigators and 120 researchers and academic staff with extensive years of research expertise in materials and advanced semiconductor devices.  \nWhat do we offer?  \n▪ E6NanoFab is open for access to all academic researchers and industry collaborators.  \n▪ We help you match your R&D requirements with right experts to solve specific problems.  \n▪ Industry partnership programme to collaborate on leading-edge research projects.  \nDeposition and Growth  \nThe flexibility of E6NanoFab deposition and growth equipment allows custom configuration for wide variety of application and development purposes.  \nAtomic Layer Deposition (ALD)  \n• Precursor: TDMAHf, TEMAZr, Ozone, H2O, TMA, SAM-24.  \n• Films: Al2O3, HfO2, ZrO2, HZO and SiO2 .  \n• Beneq| L5 Cleanroom.  \nAtomic Layer Deposition (ALD)  \n• Precursors: Solid, liquid and gas.  \n• Films: AI203, HfO2, ZrO, TiN, ZnO and SiO2 .  \n• Picosun | L5 Cleanroom.  \nPlasma Enhanced Chemical Vapour Deposition (PECVD)  \n• Up to 6 mass flow-controlled gas line.  \n• Targets: SiNx, SiO2, & a-Si.  \n• Oxford | L5 Cleanroom.  \nDeposition and Growth  \nUltra High Vacuum Metal and Dielectric Sputtering  \n• Up to 700°C on substrate.  \n• O2 environment heating  \n• Targets: Ti, Al, IGZO, ZnO, TiN, Mo, W, Nb , Ni, Sn , ITO &z etc.  \n• Gases: Ar, N2 & O2.  \n• Substrate RF bias cleaning  \n• AJA | L1 Cleanroom.  \nUltra High Vacuum E-Beam Evaporator  \n• Up to 700°C on substrate.  \n• Targets: Ti, Al, Si, SiO2, Ag, Au, Pt, Pd, TiN, Mo, Ni, Ta2O5 , Nb, Cr, Al2O3, & ITO.  \n• AJA | L1 Cleanroom.  \nDeposition and Growth  \nThermal Evaporator  \n• Irregular to 8” diameter wafer.  \n• Targets: Al, Ni, Ti, Au, Au-Ge, Pd & Pt.  \n• Edward Auto 306 Turbo | L2 Dry Lab.  \nMolecular Beam Epitaxy System (MBE)  \nThe fully integrated MBE system allows deposition of hetero-structures and semiconductors. IV and II-VI group deposition chambers are integrated with transfer chamber and load lock. The system has 5 ports for each chamber.  \n• Effusion cell for chalcogen material up to 1300°C (Si, Ge, Sn) .  \n• Heating up to 1000°C with heating rate up to 20°C per minute.  \n• Available Material for Group IV: Si, C, Ge, Sn.  \n• Transition metal targets: Mo, W, Zr, Hf.  \n• Chalcogen targets: S, Se, Te.  \n• Base Pressure : better than 5 x 10-10 Torr  \n• ULVAC | L6-06-11  \nEtching Process  \nIon Beam Deposition and Etching (IBE)  \n• SIMS option is available to enable in-situ measurement of sputtered material from substrate.  \n• Etch rate: > 8 nm/min, uniformity: ≤ 8% 3σ, rreproducibility (10 runs) ≤ 3 % 3σ .  \n• Deposition rate (Ta) > 6 nm/min, uniformity: ≤ 3 % 3σ , reproducibility (10 runs) ≤ 2 % 3σ .  \n• Available target: Si, SiO2, Si3N4, Ta.  \n• Process Gas: Ar, N2, O2 .  \n• SCIA Coat 200 | L1 Cleanroom.  \nXenon Difluoride (XeF2) Etcher  \n• The XeF2 etcher is a kind of vapour etcher where reactive gas spontaneously reacts with a material in vapour phase.  \n• It can etch Si and Ge isotopically and offers excellent selectivity to various materials such as Al, SiO2, Si3N4 and photoresis","cbCaibNNGO0EjKhP","https://ap.wps.com/l/cbCaibNNGO0EjKhP","pdf",1948816,29,"English","# Capability\n## Fabrication process flow\n# Deposition and Growth\n## Atomic Layer Deposition (ALD)\n## Plasma Enhanced Chemical Vapour Deposition (PECVD)\n## Ultra High Vacuum sputtering and E-beam evaporation\n## Thermal evaporation\n## Molecular Beam Epitaxy (MBE)\n# Etching Process\n## Ion Beam Deposition and Etching (IBE)\n## Xenon Difluoride (XeF2) Etcher\n## ICP Etch Cluster\n## Reactive Ion Plasma Etching System\n## Plasma Asher","[{\"question\":\"What is E6NanoFab’s primary role in research collaboration?\",\"answer\":\"E6NanoFab enables and streamlines micro-nanofabrication R\\u0026D by supporting multidisciplinary academic and industrial activities in nanotechnology and microelectronics. It also matches researchers with relevant experts to solve specific problems.\"},{\"question\":\"What fabrication capabilities are offered beyond deposition equipment?\",\"answer\":\"E6NanoFab supports the full fabrication process flow, including frontend and backend processing and packaging. It also operates multiple cleanroom environments and offers extensive characterization and process tools.\"},{\"question\":\"Which deposition technologies does E6NanoFab provide?\",\"answer\":\"E6NanoFab provides Atomic Layer Deposition (ALD), PECVD, ultra-high vacuum metal/dielectric sputtering, ultra-high vacuum E-beam evaporation, thermal evaporation, and Molecular Beam Epitaxy (MBE). Each includes listed precursors/targets and operating details.\"},{\"question\":\"How does E6NanoFab support micro-nano patterning and surface treatment?\",\"answer\":\"It offers etching processes including Ion Beam Deposition and Etching (IBE), XeF2 vapor etching, ICP etch cluster modules for metal/dielectric/III-V compounds, and reactive ion plasma etching systems, covering both dry and wet needs stated in the document.\"}]","E6NanoFab - Enabling cutting-edge research | PDF",73]