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Includes individual power-stage overload monitoring, on-chip temperature monitoring, and common alert logic outputs for system-level protection. Provides output power targets in bridged mode, wide single HV supply operation with internal gate-drive supply, and efficient packaging. 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The four power stage outputs are configurable as four separate Half-Bridge outputs, as two FullBridge outputs, or combinations of Half-Bridge and Full-Bridge. Individual power stage overload monitoring, on-chip temperature monitoring, and common alert logic outputs provide protection to integrate with the final system’s controller.\u003Cbr>Related Literature\u003Cbr>For a full list of related documents, visit our website: D2-24044 device page | Features\u003Cbr>• All digital class-D power stage\u003Cbr>• Four configurable power stage outputs supporting:\u003Cbr>- 2 Channels, Bridged\u003Cbr>- 4 Channels, Half-Bridge\u003Cbr>- 2 Channels, Half-Bridge, plus 1 Channel, Bridged\u003Cbr>• Output Power (bridged)\u003Cbr>- 25W (8􀀺􀀏 􀀟1% THD)\u003Cbr>- 30W (8􀀺􀀏 􀀟10% THD)\u003Cbr>• Single HV supply-wide 9V-26V range, plus internally-generated gate drive supply\u003Cbr>• Individual channel protection monitoring\u003Cbr>• Temperature and undervoltage monitoring\u003Cbr>• Efficient 38 Ld HTSSOP package\u003Cbr>Applications\u003Cbr>• PC/multimedia speakers\u003Cbr>• Digital TV audio systems\u003Cbr>• Portable device docking stations\u003Cbr>• Powered speaker systems |\n\nDigital Amplifier Power Stage  \nFN7678 Rev 1.00 Mar 18, 2019  \nPage 1 of 22  \nOrdering Information  \n\n| PART |  |  |  |  |  |  |\n| --- | --- | --- | --- | --- | --- | --- |\n| NUMBER | PART | APPLICATION | TEMP. | TAPE AND REEL | PACKAGE | PKG. |\n| ( Note 3) | MARKING | SUPPORT | RANGE (°C) | (UNITS) (Note 1) | (Pb-Free) | DWG. \\# |\n| D2-24044-MR | D2-24044-MR | Commercial | -10 to +85 | - | 38 Ld HTSSOP | M38.173C |\n| D2-24044-MR-T | D2-24044-MR | Commercial | -10 to +85 | 2.5k | 38 Ld HTSSOP | M38.173C |\n\nNOTES:  \n1. See TB347 for details about reel specifications.  \n2. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations) . The Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020 .  \n3. For Moisture Sensitivity Level (MSL), see the D2-24044 device page. For more information about MSL, see TB363 .  \nFN7678 Rev 1.00 Mar 18, 2019  \nPage 2 of 22  \nTable of Contents  \nAbsolute Maximum Ratings ................................................................................................................. 4  \nThermal Information ........................................................................................................................... 4  \nRecommended Operating Conditions ................................................................................................... 4  \nElectrical Specifications ...................................................................................................................... 4  \nPerformance Specifications ................................................................................................................. 5  \nPin Configuration ................................................................................................................................ 6  \nPin Description .................................................................................................................................... 6  \nTypical Performance Characteristics.................................................................................................... 8  \nFull-Bridge Typical Performance Curves................................................................................................. 8  \nHalf-Bridge Typical Performance Curves ................................................................................................ 9  \nFunctional Overview ........................................................","cbCaiv9wjN84NCxE","https://ap.wps.com/l/cbCaiv9wjN84NCxE","pdf",1230808,22,"English","# Absolute Maximum Ratings\n# Thermal Information\n# Recommended Operating Conditions\n# Electrical Specifications\n# Performance Specifications\n# Pin Configuration\n# Pin Description\n# Typical Performance Characteristics\n# Full-Bridge Typical Performance Curves\n# Half-Bridge Typical Performance Curves\n# Functional Overview\n# Output Options\n# Power Supply Requirements\n# High Side Gate Drive Voltage\n# Supply Bypass Connection\n# REG5V\n# Input and Control Functions\n# PW M Inputs\n# nPDN Input Pin\n# nERRORA-D Output Pins\n# nOVRT Output Pin\n# I REF Pin\n# OCFG0, OCFG1 Input Pins\n# Protection\n# Short-Circuit a","[{\"question\":\"What output configurations does the D2-24044 power stage support?\",\"answer\":\"It supports four configurable power-stage outputs that can be configured as 2 channels bridged, 4 channels half-bridge, or combinations such as 2 channels half-bridge plus 1 channel bridged.\"},{\"question\":\"How does the device provide protection for the final system controller?\",\"answer\":\"Individual channel protection monitoring, temperature monitoring, undervoltage monitoring, and common alert logic outputs support integration with the system controller.\"},{\"question\":\"What are typical applications for this digital amplifier power stage?\",\"answer\":\"Applications include PC/multimedia speakers, digital TV audio systems, portable device docking stations, and powered speaker systems.\"}]","D2-IPS Audio SOC - Digital Audio Amplifier Power Stage - Datasheet | PDF",1792981737,55]